Sony SPP-9000, 9001.pdf

SPP-S9000/S9001

SERVICE MANUAL

US Model

SPP-S9000/S9001

Canadian Model

SPP-S9001

Photo: SPP-S9001

SPECIFICATIONS

CORDLESS TELEPHONE

MICROFILM

ADJUSTMENT LOCATION:

[BASE MAIN BOARD] (Conductor Side)

TP555 : RXQN

TP556 : RXQP

TP557 : RXIN

TP558 : RXIP

level meter Chcking RX I & Q Output Level

ANTENNA TERMINAL

SSG : Checking RX I & Q Output Level

frequency counter : Checking TX Center Frequency

peak power meter : Checking TX Output

short : TP515 ÷ TP567 (GND)

Checking TX Center Frequency

[HAND MAIN BOARD] (Component Side)

ANTENNA TERMINAL

SSG : Checking RX I & Q Output Level

frequency counter : Checking TX Center Frequency

peak power meter : Checking TX Output

TP801 : RXQN

TP802 : RXQP

TP803 : RXIN

TP804 : RXIP

level meter Chcking RX I & Q Output Level

short : TP820 ÷ TP814 (GND)

Checking TX Center Frequency

SECTION 6

DIAGRAMS

SPP-S9000/S9001

THIS NOTE IS COMMON FOR PRINTED WIRING

BOARDS AND SCHEMATIC DIAGRAMS.

(In addition to this, the necessary note is printed

in each block.)

WAVEFORMS

– BASE UNIT SECTION –

6-1. IC BLOCK DIAGRAM

• HAND MAIN Board

IC502 S-24C01AFJA-TB-01

For schematic diagrams.

Note:

• All capacitors are in µF unless otherwise noted. pF: µµF

50 WV or less are not indicated except for electrolytics

and tantalums.

• All resistors are in W and 1 / 4 W or less unless otherwise

specified.

• C : panel designation.

4 Vp-p

DOUT

VCC

9.6 MHz

IC501 5 OSCI

LOGIC

DOUT/ACK

DIN

R/W

TEST

SERIAL MUX

Y DEC

Note:

The components identi-

fied by mark ! or dotted

line with mark ! are criti-

cal for safety.

Replace only with part

number specified.

Note:

Les composants identifiés par

une marque ! sont critiques

pour la sécurité.

Ne les remplacer que par une

piéce portant le numéro

spécifié.

EEPROM

ADDRESS/COUNTER

DATA WORD

– HAND SET SECTION –

DATA REGISTER

INC

LOAD

SCL

H. V. PUMP/TIMING

LOGIC

CONTROL

SERIAL

LOGIC

STOP

START

GND

SDA

4 Vp-p

• U : B+ Line.

• Power voltage is dc 9V and fed with regulated dc power

supply from external power voltage jack (J301 on the

BASE MAIN board).

• Power voltage is dc 12V and fed with regulated dc power

supply from modular jack (MJ101 on the BASE MAIN

board) with 100 W in series.

• Power voltage is dc 3.6V and fed with regulated dc power

supply from battery jack (HAND MAIN board).

• Voltages and waveforms are dc with respect to ground

under no-signal conditions.

no mark : Talk

• Voltages are taken with a VOM (Input impedance 10 M W ).

Voltage variations may be noted due to normal produc-

tion tolerances.

• Waveforms are taken with a oscilloscope.

Voltage variations may be noted due to normal produc-

tion tolerances.

• Circled numbers refer to waveforms.

• Signal path.

N : RX

O : TX

P : bell

9.6 MHz

IC401 5 OSCI

Note on Printed Wiring Boards:

Note:

• X : parts extracted from the component side.

• b : Pattern from the side which enables seeing.

SPP-S9000/S9001

6-2. PRINTED WIRING BOARD – BASE UNIT SECTION –

• Semiconductor

Location

Ref. No. Location

IC501

F-6

Q902

D-4

Q903

D-4

Q904

E-3

Q905

E-2

Q907

F-2

Q908

G-1

SPP-S9000/S9001

• Semiconductor

Location

Ref. No. Location

D101

B-2

D102

B-3

D103

B-4

D104

B-4

D105

B-5

D106

A-4

D107

A-5

D108

A-6

D301

D-2

D303

E-10

D304

E-9

D310

E-9

D502

F-5

D503

E-2

IC301

D-2

IC302

D-5

IC502

G-7

Q101

A-6

Q102

D-4

Q103

D-3

Q301

D-7

Q302

G-10

Q303

G-9

Q304

E-10

Q305

E-9

Q306

G-9

Q307

C-9

Q405

• Semiconductor

Location

Ref. No. Location

D573

A-4

D574

A-4

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