WORKING INSTRUCTION.pdf

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WI HVC
Working Instruction, Electrical
Working Instruction, Electrical
Applicable for V800/ 802se
INDEX
3/000 21-2/FEA 209544/88 C
Company Internal Sony Ericsson Mobile Communications AB
Approved according to 000 21-LXE 107 42/1
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Working Instruction , Electrical
1 Lead free soldering
In this chapter there is an introduction that will explain what is important to think about when
working with the product.
1.1
Introduction
This products soldering process is lead-free. It is important that all contact surfaces are kept
clean from dirt and hand-grease. During electrical repair, it is critical to make sure that no
lead is introduced.
1.1.1 Environment
The introduction of the environment is as follow:
Information text
1
This symbol indicates that the product is lead
free.
2 All lead free PCB will be marked with this
symbol, according to the arrow.
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Company Internal Sony Ericsson Mobile Communications AB
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Working Instruction , Electrical
Information text
3 A lead free work area must be set up that is
completely separated from work areas that are
used to make leaded repairs.
The lead-free work area must also be clearly
marked with the lead free symbol as shown in
the figure beside.
The items in this table must remain lead free.
They must be adequately marked to make their
lead free status clearly and easily recognized.
1.1.2 Soldering temperature
The characteristics of Lead Free Solder paste is:
• High melting point (Typically 220 C)
• Low wet ability
• High surface tension
• Difficult to spread
Recommended tip temperature 370 C
When servicing PCBªs that is produced with Lead Free Solder paste this paste must be used.
Otherwise there is a high risk for unreliable soldering joints.
A smaller introduction of the solder temperature, with pictures, is as follow:
Information text
1 Lead Free Solder joints are more difficult to
inspect because they do not have shiny surfaces
like leaded solders joints.
Lead Free Solder does not flow as well as
leaded solder. Some of the solder pad area may
remain exposed.
The picture shows an example of Lead Free
Solders joints.
3/000 21-2/FEA 209544/88 C
Company Internal Sony Ericsson Mobile Communications AB
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Working Instruction , Electrical
Information text
2 The picture shows an example of solder joints
with lead.
3 The picture shows an example of lead free
solder joints.
4 The picture shows an example of solder joints
with lead.
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Working Instruction , Electrical
2 BGA Equipment reflow profiles
This chapter contains recommendations for reflow profile for mobile phones and similar
products. This is only general recommendation and considerations have to be taken for every
single product. The solder paste is secondary but could also affect the parameters.
In this document one alloy is specified:
SnAgCu (Lead free) melting point 217 C
2.1
Temperature measurement
At least 4 probes should be used:
They should be placed on components with the highest and lowest thermal mass.
They shall be located in the beginning, in the middle and at the end of the board/panel.
They are recommended to be soldered on the board but glue and capton tape could also be
used if necessary.
At least one probe shall be placed in the air or on top of a component.
These values are strongly depending on the BGA replacement equipment.
Nozzle type will be chosen after the outer size of the actual component. Make sure the nozzle
does not affect any near placed components.
NOTE:
These values are recommendations and may have to be changed depending on the type of
equipment.
The maximum temperature for any component must not exceed 250C.
3/000 21-2/FEA 209544/88 C
Company Internal Sony Ericsson Mobile Communications AB
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