LEVEL 3 Ver. 1.1.pdf
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DSC-HX1
DSC-HX1
SERVICE MANUAL
LEVEL
3
US Model
Canadian Model
AEP Model
UK Model
E Model
Australian Model
Hong Kong Model
Chinese Model
Korea Model
Argentine Model
Japanese Model
Tourist Model
Ver. 1.1 2009.04
Revision History
Revised-1
Replacement of the previously issued
SERVICE MANUAL 9-852-686-11
with this manual.
Link
SCHEMATIC DIAGRAMS
PRINTED WIRING BOARDS
REPAIR PARTS LIST
The components identified by
mark 0 or dotted line with
mark 0 are critical for safety.
Replace only with part num-
ber specified.
Les composants identifiés par une
marque 0 sont critiques pour la
sécurité.
Ne les remplacer que par une pièce
portant le numéro spécifié.
DIGITAL STILL CAMERA
DSC-HX1_L3
2009D0500-1
© 2009.4
Published by Kohda TEC
9-852-686-12
Sony EMCS Co.
ENGLISH
JAPANESE
CAUTION
Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type.
Dispose of used batteries according to the instructions.
SAFETY-RELATED COMPONENT WARNING!!
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE
0
SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
COMPONENTS IDENTIFIED BY MARK
0
OR DOTTED LINE WITH
MARK
0
ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
SAFETY CHECK-OUT
After correcting the original service problem, perform the following
safety checks before releasing the set to the customer.
1. Check the area of your repair for unsoldered or poorly-soldered
connections. Check the entire board surface for solder splashes
and bridges.
2. Check the interboard wiring to ensure that no wires are
“pinched” or contact high-wattage resistors.
3. Look for unauthorized replacement parts, particularly
transistors, that were installed during a previous repair. Point
them out to the customer and recommend their replacement.
4. Look for parts which, through functioning, show obvious signs
of deterioration. Point them out to the customer and
recommend their replacement.
5. Check the B+ voltage to see it is at the values specified.
6. Flexible Circuit Board Repairing
•Keep the temperature of the soldering iron around 270˚C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40
°
C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350
C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
•Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
°
DSC-HX1_L3
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ENGLISH
JAPANESE
ENGLISH
JAPANESE
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ѻઆ໌ॻͷҙࣄ߲Λඞ͓ͣकΓԼ͍͞ɻ
ࢦఆ෦ͷ͝༻Λ
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•
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•
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ແԖాʹ͍ͭͯ
ແԖాΛ༻͍ͯ͠Δج൘ʹɼແԖʢ-FBE'SFFʣΛҙ
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ɿϨουϑϦʔϚʔΫ
ແԖాʹɼҎԼͷಛੑ͕͋Γ·͢ɻ
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ैདྷͷాͯ͜Λͦͷ··༻͢Δ͜ͱՄೳͰ͢
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Թௐઅػೳͷ͍ͭͨాͯ͜Λ༻͢Δ߹ɼ
ˆʹઃఆͯ͠Լ͍͞ɻ
ҙɿాͯ͜Λͯ͗͘͢Δͱɼج൘ͷύλʔ
ϯʢಔഩʣ͕͕Εͯ͠·͏͜ͱ͕͋Γ·͢
ͷͰɼҙͯ͠Լ͍͞ɻ
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ैདྷͷాΑΓ೪ੑ͕ڧ͍ͨΊɼ*$ࢠͳͲ͕ా
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औ֎ͨ͠෦࠶༻͠ͳ͍ͰԼ͍͞ɻ
• λϯλϧίϯσϯαͷϚΠφεଆʹऑ͍ͨΊަ
࣌ҙͯ͠Լ͍͞ɻ
•
ैདྷͷాͱࠞͥͯ༻Մೳ
ແԖాʹແԖాΛՃ͢Δͷ͕࠷దͰ͕͢ɼ
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DSC-HX1_L3
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ENGLISH
JAPANESE
4-2. SCHEMATIC DIAGRAMS
Link
CMS-007 BOARD (CMOS IMAGER)
SY-218 BOARD (6/11)
(HDMI TRANSMITTER)
SY-218 BOARD (1/11)
(LENS DRIVE, OIS DRIVE)
SY-218 BOARD (2/11)
(CPU (SIGNAL PROCESS))
SY-218 BOARD (3/11)
(CPU (SIGNAL PROCESS))
SY-218 BOARD (4/11)
(CPU (SIGNAL PROCESS))
SY-218 BOARD (7/11) (AUDIO/VIDEO AMP)
SY-218 BOARD (8/11) (FRONT CONTROL)
SY-218 BOARD (9/11) (DC IN)
SY-218 BOARD (10/11)
(DC/DC CONVERTER)
SY-218 BOARD (5/11)
(AUDIO/VIDEO CODEC)
SY-218 BOARD (11/11) (CONNECTOR)
COMMON NOTE FOR SCHEMATIC DIAGRAMS
DSC-HX1_L3
4-2. SCHEMATIC DIAGRAMS
ENGLISH
JAPANESE
4. PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
4-2. SCHEMATIC DIAGRAMS
(ENGLISH)
THIS NOTE IS COMMON FOR SCHEMATIC DIAGRAMS
(In addition to this, the necessary note is printed in each block)
(For schematic diagrams)
• All capacitors are in
µ
F unless otherwise noted. pF :
µ
µ
F. 50 V or less are not indicated except for electrolytics
and tantalums.
• Chip resistors are 1/10 W unless otherwise noted.
k
1. Connection
Pattern box
Color bar chart
Pattern box PTB-450
J-6082-200-A
or
Small pattern box
PTB-1450
J-6082-557-A
For PTB-450:
J-6020-250-A
.
• Caution when replacing chip parts.
New parts must be attached after removal of chip.
Be careful not to heat the minus side of tantalum
capacitor, Because it is damaged by the heat.
• Some chip part will be indicated as follows.
Example
=1000
Ω
, M
Ω
=1000 k
Ω
For PTB-1450:
J-6082-559-A
C541
L452
L = 17 cm (PTB-450)
L = 7 cm (PTB-1450)
Pattern box
22U
10UH
Front of the lens
TA A
2520
Kinds of capacitor
Case size
External dimensions (mm)
L
Camera
differ according to the model/destination.
Refer to the mount table for each function.
• All variable and adjustable resistors have characteristic
curve B, unless otherwise noted.
• Signal na
me
XEDIT
★
2. Adjust the distance so that the output waveform of
Fig. a and the Fig. b can be obtain.
H
→
EDIT
PB/XREC
→
PB/REC
•
2
: non flammable resistor
•
5
: fusible resistor
•
C
: panel designation
•
A
: B+ Line
•
B
: B– Line
•
J
: IN/OUT direction of (+,–) B LINE.
•
C
: adjustment for repair.
(Measuring conditions voltage and waveform)
•Voltages and waveforms are measured between the
measurement points and ground when camera shoots
color bar chart of pattern box. They are reference values
and reference waveforms.
(VOM of DC 10 M
Ω
input impedance is used)
•Voltage values change depending upon input
impedance of VOM used.)
A=B
Fig. a (Video output terminal output waveform)
A
B
B
A
Electronic beam
scanning frame
CRT picture frame
Fig.b (Picture on monitor TV)
Precautions for Replacement of Imager
• If the imager has been replaced, carry out all the adjustments
for the camera section.
• As the imager may be damaged by static electricity from
its structure, handle it carefully like for the MOS IC.
In addition, ensure that the receiver is not covered with
dusts nor exposed to strong light.
When indicating parts by reference number, please
include the board name.
The components identified by mark
0
or dotted line with
mark
0
are critical for safety.
Replace only with part number specified.
Les composants identifiés par une marque
0
sont
critiques pour la sécurité.
Ne les remplacer que par une pièce portant le numéro
spécifie.
DSC-HX1_L3
4-2
ENGLISH
JAPANESE
Ω
• Constants of resistors, capacitors, ICs and etc with XX
indicate that they are not used.
In such cases, the unused circuits may be indicated.
•Parts with
Plik z chomika:
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Auto-ADJ.pdf
(55 KB)
LEVEL 2 Ver. 1.1.pdf
(6800 KB)
LEVEL 3 Ver. 1.1.pdf
(3771 KB)
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