bat46.pdf

BAT46

SMALL SIGNAL SCHOTTKY DIODE

DESCRIPTION

General purpose, metalto silicon diode featuring

high breakdown voltage low turn-on voltage.

DO 35

(Glass)

ABSOLUTE RATINGS (limiting values)

Symbol

Parameter

Value

Unit

V RRM

Repetitive Peak Reverse Voltage

100

I F

Forward Continuous Current*

T a = 25

150

I FRM

Repetitive Peak Forward Current*

t p

350

0.5

I FSM

Surge non Repetitive Forward Current*

t p

10ms

750

P tot

Power Dissipation*

T I = 80°C

150

T stg

T j

Storage and Junction Temperature Range

- 65 to + 150

- 65 to + 125

T L

Maximum Temperature for Soldering during 10s at 4mm from Case

230

THERMAL RESISTANCE

Symbol

Test Conditions

Value

Unit

R th(j-a)

Junction-ambient*

300

C/W

* On infinite heatsink with 4mm lead length.

August 1999 Ed: 1A

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BAT46

ELECTRICAL CHARACTERISTICS

STATIC CHARACTERISTICS

Symbol

Test Conditions

Min.

Typ.

Max.

Unit

V BR

T j = 25

I F = 10

100

V F *

T j = 25

I F = 0.1mA

0.25

T j = 25

I F = 10mA

0.45

T j = 25

I F = 250mA

I R *

T j = 25

V R = 1.5V

0.5

T j = 60°C

T j = 25°C

V R = 10V

0.8

T j = 60°C

7.5

T j = 25°C

V R = 50V

T j = 60°C

T j = 25°C

V R = 75V

T j = 60°C

DYNAMIC CHARACTERISTICS

Symbol

Test Conditions

Min.

Typ.

Max.

Unit

T j = 25

V R = 0V

f = 1Mhz

T j = 25

V R = 1V

* Pulse test: t p

300

2% .

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BAT46

Fig. 1-1: Forward voltage drop versus forward cur-

rent (low level, typical values)

Fig. 1-2: Forward voltage drop versus forward cur-

rent (high level, typical values)

IFM(mA)

IFM(A)

5E-1

Tj=125°C

Tj=25°C

1E-1

Tj=25°C

VFM(V)

0.0

0.1

0.2

0.3

0.4

0.5

0.6

1E-2

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2

Fig. 2: Leakage current versus reverse voltage ap-

plied (typical values)

Fig. 3: Leakage current versus junction temperature

(typical values)

IR(µA)

VR=75V

1E+3

Tj=125°C

1E+3

Tj=100°C

1E+2

Tj=75°C

1E+1

Tj=50°C

1E+0

Tj=25°C

1E+0

1E-1

VR(V)

Tj(°C)

1E-1

0 0000000000

100

125

Fig. 4: Junction capacitance versus reverse voltage

applied (typical values)

C(pF)

F=1MHz

Tj=25°C

VR(V)

100

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BAT46

PACKAGE MECHANICAL DATA

DO 35 Glass

DIMENSIONS

Millimeters

REF.

Inches

Min.

Max.

Min.

Max.

3.05

4.50

0.120

0.177

/ D

1.53

2.00

0.060

0.079

12.7

0.500

0.458

0.558

0.018

0.022

Cooling method : by convection and conduction

Marking: clear, ring at cathode end.

Weight: 0.15g

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of

use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted

by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to

change without notice. This publication supersedes and replaces all information previously supplied.

STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval

of STMicroelectronics.

The ST logo is a registered trademark of STMicroelectronics

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