tx-32lx60a_lh59_4569.pdf

ORDER NO. SMT0603006CE

LCD TV

TX-32LX60A

TX-26LX60A

LH59 Chassis

Specifications

TX-26LX60M/X/A

TX-32LX60M/X/A

Power Source

AC 110-240 V, 50 / 60 Hz

Power Consumption

Average use : 109W

Average use : 168W

Standby condition: 0.9W

LCD

66.1cmV 80.0cmV

Wide XGA (1366 × 768 pixels) 16:9 aspect ratio LCD panel.

Screen Size

576mm(W) × 324mm(H)

698mm(W) × 392mm(H)

Sound

Speaker

12cm × 6cm × 2 pcs, 4 Ω

Audio Output

20 W (10W + 10W) , 10%THD

20 W (10W + 10W), 10%THD

Headphones

M3 (3.5 mm) Jack × 1

Receiving System/Band name

rights reserved. Unauthorized copying and

distribution is a violation of law.

TX-32LX60M / TX-32LX60X / TX-32LX60A / TX-26LX60M / TX-26LX60X / TX-26LX60A

Receiving Channels

Regular TV

VHF BAND

2-12 (PAL /SECAM B, K1)

0-12 (PAL B AUST.)

1-9 (PAL B N.Z)

1-12 (PAL/SECAM D)

1-12 (NTSC M Japan)

2-13 (NTSC M U.S.A)

UHF BAND

21-69 (PAL G, H, I/SECAM G, K, K1)

28-69 (PAL AUST.)

13-57 (PAL D, K)

13-62 (NTSC M Japan)

14-69 (NTSC M U.S.A)

CATV

S1-S20 (OSCAR)

1-125 (U.S.A CATV)

C13-C49 (JAPAN)

S21-S41 (HYPER)

Z1-Z37 (CHINA)

5A, 9A (AUST.)

Aerial-Rear

UHF/ VHF

Operating Conditions

Temperature : 5°C - 40°C

Humidity : 5 % - 90 % RH (non-condensing)

Connection Terminals

AV1

VIDEO (RCA Pin Type)

1.0 Vp-p (75 Ω )

S-VIDEO (MINI DIN 4-pin)

Y: 1.0 Vp-p (75 Ω ), C: 0.286 Vp-p (75 Ω )

AUDIO L-R (RCA Pin Type × 2)

0.5 Vrms

AV2

VIDEO (RCA Pin Type)

1.0 Vp-p (75 Ω )

AUDIO L-R (RCA Pin Type × 2)

0.5 Vrms

1.0 Vp-p (including synchronization)

P B C B /P R C R

±0.35 Vp-p

AV3

VIDEO (RCA Pin Type)

1.0 Vp-p (75 Ω )

S-VIDEO (MINI DIN 4-pin)

Y: 1.0 Vp-p (75 Ω ), C: 0.286 Vp-p (75 Ω )

AUDIO L-R (RCA Pin Type × 2)

0.5 Vrms

HDMI 1/2

TYPE A Connectors

Audio Input for HDMI1

RCA PIN Type × 2

0.5 Vrms

MONITOR OUT

VIDEO (RCA Pin Type)

1.0 Vp-p (75 Ω )

AUDIO L-R (RCA Pin Type × 2)

0.5 Vrms

Dimensions ( W x H x D )

Including TV Stand

657mm × 525mm × 300mm

791mm × 615mm × 300mm

TV Set Only

657mm × 473mm × 128mm

791mm × 563mm × 128mm

Weight

15.0 kg Net

19.0 kg Net

TX-32LX60M / TX-32LX60X / TX-32LX60A / TX-26LX60M / TX-26LX60X / TX-26LX60A

Note:

Design and specifications are subject to change without notice. Weight and Dimensions shown are approximate.

CONTENTS

Page

1 Safety Precautions

10.4. Option Code Setting

1.1.General Guidelines

11 Adjustment

2 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

11.1. Voltage chart of A board

11.2. Voltage chart of AP board

3 About lead free solder (PbF)

11.3. DVCO adjustment

4 Input signal that can be displayed

12 Conuctor Views

5 Self-check function

12.1. A-Board

5.1.How to access

12.2. AP-Board

5.2.Screen display

12.3. G-Board

6 Chassis Board Layout

12.4. V-Board

7 Disassembly for Service

13 Block and Schematic Diagram

7.1.Pedestal ass 鉹

13.1. Schematic Diagram Notes

7.2.Rear cover

13.2. Main Block Diagram

7.3.Rear Support MTG (Left and right)

13.3. P.B.C. Block Diagram

7.4.AC cord

13.4. Signal Schematic Diagram

7.5.Tuner Cover Ass 鉹

13.5. A-Board (1 of 5) Schematic Diagram

7.6.Power Button Bracket Ass 鉹

13.6. A-Board (2 of 5) Schematic Diagram

7.7.Control Panel Ass 鉹

13.7. A-Board (3 of 5) Schematic Diagram

7.8.Power Supply unit

13.8. A-Board (4 of 5) Schematic Diagram

7.9.A-Board

13.9. A-Board (5 of 5) Schematic Diagram

7.10. AP-Board

13.10. AP-Board (1 of 2) Schematic Diagram

7.11. G-Board

13.11. AP-Board (2 of 2) Schematic Diagram

7.12. V-Board and Led Panel

13.12. G and V-Board Schematic Diagram

7.13. Speaker

14 Parts Location & Mechanical Replacement Parts List

7.14. Main chassia Ass 鉹

14.1. Parts Location

7.15. LCD Panel

15 Packing Exploded View

8 Location of Lead Wiring

16 Mechanical Replacement Parts List

9 EMI Processing

17 Electrical Replacement Parts List

10 Service Mode Function

17.1. Replacement Parts List Notes

10.1. How to enter SERVICE 1

17.2. Electrical Replacement Parts List

10.2. How to enter SERVICE 2

18 Blank Page

10.3. Option Description

TX-32LX60M / TX-32LX60X / TX-32LX60A / TX-26LX60M / TX-26LX60X / TX-26LX60A

1 Safety Precautions

1.1. General Guidelines

1.When servicing, observe the original lead dress. If a short circuit is found, replace all parts which have been overheated or

damaged by the short circuit.

2.After servicing, see to it that all the protective devices such as insulation barriers, insulation papers shields are properly

installed.

3.After servicing, make the following leakage current checks to prevent the customer from being exposed to shock hazards.

1.1.1. Leakage Current Cold Check

1.Unplug the AC cord and connect a jumper between the two

prongs on the plug.

2.Measure the resistance value, with an ohmmeter, between

the jumpered AC plug and each exposed metallic cabinet

part on the equipment such as screwheads, connectors,

control shafts, etc. When the exposed metallic part has a

return path to the chassis, the reading should be between

1M Ω and 5.2M Ω .

When the exposed metal does not have a return path to the

chassis, the reading must be

1.1.2. LEAKAGE CURRENT HOT CHECK

(See Figure 1.)

1.Plug the AC cord directly into the AC outlet. Do not use an

isolation transformer for this check.

2.Connect a 1.5k Ω , 10 watts resistor, in parallel with a 0.15µF

capacitors, between each exposed metallic part on the set

and a good earth ground such as a water pipe, as shown in

Figure 1.

3.Use an AC voltmeter, with 1000 ohms/volt or more

sensitivity, to measure the potential across the resistor.

4.Check each exposed metallic part, and measure the

voltage at each point.

5.Reverse the AC plug in the AC outlet and repeat each of the

above measurements.

6.The potential at any point should not exceed 0.75 volts

RMS. A leakage current tester (Simpson Model 229 or

equivalent) may be used to make the hot checks, leakage

current must not exceed 1/2 milliamp. In case a

measurement is outside of the limits specified, there is a

possibility of a shock hazard, and the equipment should be

repaired and rechecked before it is returned to the

customer.

Figure 1

2 Prevention of Electro Static Discharge (ESD) to

Electrostatically Sensitive (ES) Devices

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components commonly are called

Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and

semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage

caused by electro static discharge (ESD).

1.Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any ESD on your

body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging ESD wrist strap,

which should be removed for potential shock reasons prior to applying power to the unit under test.

2.After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as

aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3.Use only a grounded-tip soldering iron to solder or unsolder ES devices.

4.Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static (ESD protected)" can

generate electrical charge sufficient to damage ES devices.

5.Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices.

6.Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most

replacement ES devices are packaged with leads electrically shorted together by conductive foam, alminum foil or comparable

conductive material).

7.Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material

to the chassis or circuit assembly into which the device will be installed.

Caution

Be sure no power is applied to the chassis or circuit, and observe all other safety precautions.

TX-32LX60M / TX-32LX60X / TX-32LX60A / TX-26LX60M / TX-26LX60X / TX-26LX60A

8.Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise hamless motion such as the brushing

together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity (ESD) sufficient to

damage an ES device).

3 About lead free solder (PbF)

Note: Lead is listed as (Pb) in the periodic table of elements.In the information below, Pb will refer to Lead solder, and PbF

will refer to Lead Free Solder.The Lead Free Solder used in our manufacturing process and discussed below is

(Sn+Ag+Cu).That is Tin (Sn), Silver (Ag) and Copper (Cu) although other types are available.

This model uses Pb Free solder in it.s manufacture due to environmental conservation issues. For service and repair work, we.d

suggest the use of Pb free solder as well, although Pb solder may be used.

PCBs manufactured using lead free solder will have the PbF within a leaf Symbol

stamped on the back of PCB.

Caution

· Pb free solder has a higher melting point than standard solder. Typically the melting point is 50 ~ 70°F (30~40°C) higher.

Please use a high temperature soldering iron and set it to 700 ± 20°F (370 ± 10°C).

· Free solder will tend to splash when heated too high (about 1100°F or 600°C).

If you must use Pb solder, please completely remove all of the Pb free solder on the pins or solder area before applying

Pbsolder. If this is not practical, be sure to heat the Pb free solder until it melts, before applying Pb solder.

· After applying PbF solder to double layered boards, please check the component side for excess solder which may flow onto

the opposite side. (see figure below)

Suggested Pb free solder

There are several kinds of Pb free solder available for purchase. This product uses Sn+Ag+Cu (tin, silver, copper) solder.

However, Sn+Cu (tin, copper), Sn+Zn+Bi (tin, zinc, bismuth) solder can also be used.

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