Comprehensive Microsystems [3 Vols] - Y. Gianchandani, et al., (Elsevier, 2007) WW.pdf - Najnowsze ksiazki(48) - walbo48

Editors-in-Chief

Yogesh B. Gianchandani is a Professor in the EECS Department and holds a courtesy appointment in the

Department of Mechanical Engineering at the University of Michigan, Ann Arbor. He received a Ph.D. in

electrical engineering from the same university in 1994. Prior to this, he worked as an IC designer, primarily

at Xerox Corporation. His research interests include all aspects of design, fabrication, and packaging of

micromachined sensors and actuators and their interface circuits. He has contributed to more than 200 papers

or patents in this field, and serves on the editorial boards of several journals. He also served as a General

Co-Chair for the IEEE/ASME International Conference on Micro Electro Mechanical Systems (IEEE MEMS)

in 2002. At the University of Michigan, Prof. Gianchandani has served as the director of the College of

Engineering Interdisciplinary Professional Degree Program in Integrated Microsystems. As of 2007, he is on a

temporary assignment at the US National Science Foundation, serving in the Directorate for Engineering as a

program manager for nano- and microsystems.

iii

iv Editors-in-Chief

Professor Osamu Tabata Born in 1956. He received a MS degree and a Ph.D. degree from the Nagoya Institute

of Technology, Nagoya, Japan, in 1981 and in 1993, respectively. Since 1981 for 15 years, he has been with the

Toyota Central Research and Development Laboratories, Japan. In 1996, he joined the Department of

Mechanical Engineering, Ritsumeikan University, Shiga, Japan. He was a guest Professor of Institute of

Microsystem Technology, University of Freiburg and ETH Zurich from September to December 2000 and

from January to March 2001, respectively. In 2003, he joined the Department of Mechanical Engineering,

Kyoto University, Japan. He is currently Professor in the Department of Micro Engineering, Kyoto University.

He is currently interested in the establishment of a technology to realize a unique and novel nanosystem by

assembling the various functional components such as a microchip, and a particle, a microcapsule, and a cell,

with sizes ranging from the nanometer to micrometer scale on a MEMS/NEMS substrate. He termed this

concept as SENS (synthetic engineering for nanosystems), and is pursuing experimental and theoretical

research on the establishment of SENS. He is an associate editor of Journal of Micro Electro Mechanical

Systems as well as a member of the editorial board of Advanced Micro- and Nanosystems, and Sensors and

Actuators. Also he is a program committee member of many International Conferences.

Editors-in-Chief v

Professor Hans Zappe was born in Paris, France, in 1961 and raised in New York. He received his B.Sc. and

M.Sc. in Electrical Engineering from the Massachusetts Institute of Technology in 1983 and his Ph.D. in the

same field from the University of California at Berkeley in 1989. He has worked at IBM (Burlington, VT, USA)

on silicon VLSI, at the Fraunhofer Institute for Applied Solid State Physics (Freiburg, Germany) on GaAs

electronics and high-speed lasers, and at the Centre Suisse d’Electronique et de Microtechnique (Zurich,

Switzerland) on integrated optical microsystems and surface-emitting lasers. Since 2000, he has been Professor

in the Department of Microsystems Engineering at the University of Freiburg, Germany. His current research

interests focus on the development of novel tunable micro- optical components, including polymer, membrane,

and liquid-based optics, variable photonic crystals, and optical microsystems for medical diagnostics and

clinical applications.

Preface

Microsystems have emerged from the laboratory and have become essential components in a wide range of

medical and industrial products, and research instrumentation. They include not only microelectromechanical

systems (MEMS), but all forms of microsensors, microactuators, and interface microelectronics, deployed as

enabling components within a larger system or distributed network. Combining high functionality with small

dimensions and reduced power consumption, microsystems benefit from mass-fabrication technologies to allow

their manufacture in high volumes and, often, at low cost. The inclusion of electronics, when possible, reduces

the cost of deployment and use, providing autocalibration and self-testing. The small dimensional scale

sometimes allows physical effects to be leveraged in unconventional ways, providing surprisingly high

functionality and performance. As a result, microsystems are virtually invisible to most people, yet have

become indispensable in many aspects of their lives.

The microsystems field has expanded to embrace a host of technologies. The well-established discipline of

microelectronics has now been joined by micromechanics, microfluidics, and microoptics to allow the fabrica-

tion of complex, multifunctional integrated microsystems. As a result, the highly interdisciplinary nature of the

subject often makes it difficult for researchers to obtain an overview of the technologies and capabilities

available in this established yet dynamically growing engineering field. Thanks to a superb collection of

authors, reviewers, and Editorial Advisory Board members, we are confident that Comprehensive Microsystems

represents an authoritative primary reference source that addresses this need.

As its title suggests, the book before you covers virtually all aspects of the microsystems field. In 54 chapters,

the work discusses a breadth of topics, which underscores the interdisciplinary nature of research and

development in microsystems and MEMS, a spectrum that has few parallels in other technical disciplines. As

a readable reference work, Comprehensive Microsystems provides engineers, students, and educators with a unified

source of information that will prove to be useful for new as well as established microsystems researchers.

The book is thematically divided into sections that cover a variety of topics; the chapters are self-contained,

yet cross-referenced, allowing readers to easily obtain relevant related information. The book opens with a

section on Materials, including chapters on silicon as well as metals and polymers, and continues with

Fabrication and Packaging, in which the topics range from micromachining to self-assembly and packaging.

Moving to an overview of some of the basic components used in microsystems, the section Electronics and

System Design covers areas including electronic interface circuits and simulation, and Actuation Mechanisms

has chapters on electrostatic, magnetic, and thermal actuation.

The exceptionally wide variety of application areas in which microsystems play a role is reflected in the

range of sections that follow. Physical Sensing includes contributions on pressure and flow sensors, gyroscopes,

and accelerometers, whereas microfluidics, micropumps, and chemical sensors are only a few of the topics

found in the section Chemical and Biological Systems. Finally, the rich spectrum of activities discussed in

Optical Systems includes micromirrors, the artificial retina, and biophotonics.

Realizing that the MEMS and microsystems fields have led to mature products in a number of industrial

applications as well as provided inspiration for research in unexplored areas, the work concludes with a section

Industrial Applications, in which chapters discuss radio-frequency MEMS, medical applications, and ink-jets,

and finally Emerging Topics, a look toward the future in which MEMS atomic clocks, microcombustion

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