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DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
M3D186
BF494; BF495
NPN medium frequency transistors
Product specification
Supersedes data of September 1994
File under Discrete Semiconductors, SC04
1997 Jul 08
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Philips Semiconductors
Product specification
NPN medium frequency transistors
BF494; BF495
FEATURES
PINNING
·
Low current (max. 30 mA)
PIN
DESCRIPTION
·
Low voltage (max. 20 V).
1
base
2
emitter
APPLICATIONS
3
collector
·
HF applications in radio and television receivers
·
FM tuners
·
Low noise AM mixer-oscillators
handbook, halfpag 1
2
3
·
IF amplifiers in AM/FM receivers.
3
1
DESCRIPTION
MAM258
2
NPN medium frequency transistor in a TO-92; SOT54
plastic package.
Fig.1 Simplified outline (TO-92; SOT54)
and symbol.
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V CBO
collector-base voltage
open emitter
-
30
V
V CEO
collector-emitter voltage
open base
-
20
V
I CM
peak collector current
-
30
mA
P tot
total power dissipation
T amb £
25
°
C
-
300
mW
h FE
DC current gain
I C = 1 mA; V CE =10V
BF494
67
220
BF495
35
125
f T
transition frequency
I C = 1 mA; V CE = 10 V; f = 100 MHz
120
-
MHz
1997 Jul 08
2
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Philips Semiconductors
Product specification
NPN medium frequency transistors
BF494; BF495
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
V CBO
collector-base voltage
open emitter
-
30
V
V CEO
collector-emitter voltage
open base
-
20
V
V EBO
emitter-base voltage
open collector
-
5
V
I C
collector current (DC)
-
30
mA
I CM
peak collector current
-
30
mA
P tot
total power dissipation
T amb £ 25 ° C; note 1
-
300
mW
T stg
storage temperature
-
65
+150
°
C
T j
junction temperature
-
150
°
C
T amb
operating ambient temperature
-
65
+150
°
C
Note
1. Transistor mounted on an FR4 printed-circuit board.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
R th j-a
thermal resistance from junction to ambient note 1
420
K/W
Note
1. Transistor mounted on an FR4 printed-circuit board.
CHARACTERISTICS
T amb =25 ° C unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
I CBO
collector cut-off current
I E = 0; V CB =20V
-
100
nA
I E = 0; V CB =20V; T amb = 150 ° C
-
4
m A
I EBO
emitter cut-off current
I C = 0; V EB =4V
-
100
nA
h FE
DC current gain
I C = 1 mA; V CE =10V
BF494
67
220
BF494B
100
220
BF495
35
125
BF495B
100
125
V BE
base-emitter voltage
I C = 1 mA; V CE = 10 V
650
740
mV
C re
feedback capacitance
I C = 0; V CB = 10 V; f = 1 MHz
-
1
pF
f T
transition frequency
I C = 1 mA; V CE = 10 V; f = 100 MHz
120
-
MHz
1997 Jul 08
3
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Philips Semiconductors
Product specification
NPN medium frequency transistors
BF494; BF495
PACKAGE OUTLINE
Plastic single-ended leaded (through hole) package; 3 leads
SOT54
c
E
d
A
L
b
1
2
e 1
D
e
3
b 1
L 1
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b
b 1
0.66
0.56
c
D
d
E
e
e 1
L
L 1 (1)
mm
5.2
5.0
0.48
0.40
0.45
0.40
4.8
4.4
1.7
1.4
4.2
3.6
2.54
1.27
14.5
12.7
2.5
Note
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.
OUTLINE
VERSION
REFERENCES
EUROPEAN
PROJECTION
ISSUE DATE
IEC
JEDEC
EIAJ
SOT54
TO-92
SC-43
97-02-28
1997 Jul 08
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Philips Semiconductors
Product specification
NPN medium frequency transistors
BF494; BF495
DEFINITIONS
Data Sheet Status
Objective specification
This data sheet contains target or goal specifications for product development.
Preliminary specification
This data sheet contains preliminary data; supplementary data may be published later.
Product specification
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1997 Jul 08
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