54F64.pdf

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November 1994
54F/74F64
4-2-3-2-Input AND-OR-Invert Gate
General Description
This device contains gates configured to perform a 4-2-3-2
input AND-OR-INVERT function.
Package
Commercial
Military
Package Description
Number
74F64PC
N14A
14-Lead (0.300 × Wide) Molded Dual-In-Line
54F64DM (Note 2)
J14A
14-Lead Ceramic Dual-In-Line
14-Lead (0.150 × Wide) Molded Small Outline, JEDEC
74F64SC (Note 1)
M14A
54F64FM (Note 2)
W14B
14-Lead Cerpack
54F64LM (Note 2)
E20A
20-Lead Ceramic Leadless Chip Carrier, Type C
Note 1: Devices also available in 13 × reel. Use suffix e SCX.
Note 2: Military grade device with environmental and burn-in processing. Use suffix e DMQB, FMQB and LMQB.
Logic Symbol
Connection Diagrams
Pin Assignment for
DIP, SOIC and Flatpak
Pin Assignment
for LCC
IEEE/IEC
TL/F/9467±2
TL/F/9467±1
TL/F/9467±3
Unit Loading/Fan Out
54F/74F
Pin Names
Description
U.L.
Input I IH /I IL
HIGH/LOW
Output I OH /I OL
20 m A/ b 0.6 mA
A n ,B n ,C n ,D n
Inputs
1.0/1.0
O
Output
50/33.3
b 1 mA/20 mA
TRI-STATE É is a registered trademark of National Semiconductor Corporation.
C 1995 National Semiconductor Corporation
TL/F/9467
RRD-B30M105/Printed in U. S. A.
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Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Storage Temperature
Recommended Operating
Conditions
Free Air Ambient Temperature
Military
b 55 § Cto a 125 § C
b 65 § Cto a 150 § C
0 § Cto a 70 § C
Commercial
Ambient Temperature under Bias
b 55 § Cto a 125 § C
Supply Voltage
Military
Junction Temperature under Bias
b 55 § Cto a 175 § C
a 4.5V to a 5.5V
Plastic
b 55 § Cto a 150 § C
Commercial
a 4.5V to a 5.5V
V CC Pin Potential to
Ground Pin
b 0.5V to a 7.0V
Input Voltage (Note 2)
b 0.5V to a 7.0V
b 30 mA to a 5.0 mA
Input Current (Note 2)
Voltage Applied to Output
in HIGH State (with V CC e 0V)
Standard Output
b 0.5V to V CC
TRI-STATE É Output
b 0.5V to a 5.5V
Current Applied to Output
in LOW State (Max) twice the rated I OL (mA)
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful
life impaired. Functional operation under
these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
54F/74F
Symbol
Parameter
Units
V CC
Conditions
Min
Typ
Max
V IH
Input HIGH Voltage
2.0
V
Recognized as a HIGH Signal
V IL
Input LOW Voltage
0.8
V
Recognized as a LOW Signal
b 1.2
I IN eb 18 mA
V CD
Input Clamp Diode Voltage
V
Min
I OH eb 1mA
V OH
Output HIGH
54F 10% V CC
2.5
Voltage
74F 10% V CC
2.5
V
Min
I OH eb 1mA
I OH eb 1mA
74F 5% V CC
2.7
I OL e 20 mA
V OL
Output LOW
54F 10% V CC
0.5
V
Min
Voltage
74F 10% V CC
0.5
I OL e 20 mA
I IH
Input HIGH
54F
20.0
V IN e 2.7V
m A
Max
Current
74F
5.0
I BVI
Input HIGH Current
54F
100
V IN e 7.0V
m A
Max
Breakdown Test
74F
7.0
V OUT e V CC
I CEX
Output High
54F
250
m A
Max
Leakage Current
74F
50
V ID
Input Leakage
I ID e 1.9 m A
74F
4.75
V
0.0
Test
All Other Pins Grounded
V IOD e 150 mV
I OD
Output Leakage
74F
3.75
m A
0.0
Circuit Current
All Other Pins Grounded
I IL
Input LOW Current
b 0.6
mA
Max
V IN e 0.5V
I OS
Output Short-Circuit Current
b 60
b 150
mA
Max
V OUT e 0V
I CCH
Power Supply Current
1.9
2.8
mA
Max
V O e HIGH
I CCL
Power Supply Current
3.1
4.7
mA
Max
V O e LOW
2
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AC Electrical Characteristics
74F
54F
74F
T A ea 25 § C
T A ,V CC e Mil
T A ,V CC e Com
Symbol
Parameter
V CC ea 5.0V
Units
C L e 50 pF
C L e 50 pF
C L e 50 pF
Min
Typ
Max
Min
Max
Min
Max
t PLH
Propagation Dela y
2.5
4.6
6.5
2.5
8.5
2.5
7.5
ns
t PHL
A n ,B n ,C n ,D n to O
1.5
3.2
4.5
1.5
6.5
1.5
5.5
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:
74F
64
S
C
X
Temperature Range Family
Special Variations
74F e Commercial
QB e Military grade device with
54F e Military
environmental and burn-in
processing
Device Type
X e Devices shipped in 13 × reel
Package Code
Temperature Range
P e Plastic DIP
C e Commercial (0 § Cto a 70 § C)
D e Ceramic DIP
M e Military ( b 55 § Cto a 125 § C)
F e Flatpak
L e Leadless Chip Carrier (LCC)
S e Small Outline SOIC
3
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Physical Dimensions inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
14-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J14A
4
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Physical Dimensions inches (millimeters) (Continued)
14-Lead (0.150 × Wide) Molded Small Outline, JEDEC (S)
NS Package Number M14A
14-Lead (0.300 × Wide) Molded Dual-In-Line Package (P)
NS Package Number N14A
5
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