54F64.pdf
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130 KB
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Pobierz
November 1994
54F/74F64
4-2-3-2-Input AND-OR-Invert Gate
General Description
This device contains gates configured to perform a 4-2-3-2
input AND-OR-INVERT function.
Package
Commercial
Military
Package Description
Number
74F64PC
N14A
14-Lead (0.300
×
Wide) Molded Dual-In-Line
54F64DM (Note 2)
J14A
14-Lead Ceramic Dual-In-Line
14-Lead (0.150
×
Wide) Molded Small Outline, JEDEC
74F64SC (Note 1)
M14A
54F64FM (Note 2)
W14B
14-Lead Cerpack
54F64LM (Note 2)
E20A
20-Lead Ceramic Leadless Chip Carrier, Type C
Note 1: Devices also available in 13
×
reel. Use suffix
e
SCX.
Note 2: Military grade device with environmental and burn-in processing. Use suffix
e
DMQB, FMQB and LMQB.
Logic Symbol
Connection Diagrams
Pin Assignment for
DIP, SOIC and Flatpak
Pin Assignment
for LCC
IEEE/IEC
TL/F/9467±2
TL/F/9467±1
TL/F/9467±3
Unit Loading/Fan Out
54F/74F
Pin Names
Description
U.L.
Input I
IH
/I
IL
HIGH/LOW
Output I
OH
/I
OL
20
m
A/
b
0.6 mA
A
n
,B
n
,C
n
,D
n
Inputs
1.0/1.0
O
Output
50/33.3
b
1 mA/20 mA
TRI-STATE
É
is a registered trademark of National Semiconductor Corporation.
C
1995 National Semiconductor Corporation
TL/F/9467
RRD-B30M105/Printed in U. S. A.
Absolute Maximum Ratings
(Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Storage Temperature
Recommended Operating
Conditions
Free Air Ambient Temperature
Military
b
55
§
Cto
a
125
§
C
b
65
§
Cto
a
150
§
C
0
§
Cto
a
70
§
C
Commercial
Ambient Temperature under Bias
b
55
§
Cto
a
125
§
C
Supply Voltage
Military
Junction Temperature under Bias
b
55
§
Cto
a
175
§
C
a
4.5V to
a
5.5V
Plastic
b
55
§
Cto
a
150
§
C
Commercial
a
4.5V to
a
5.5V
V
CC
Pin Potential to
Ground Pin
b
0.5V to
a
7.0V
Input Voltage (Note 2)
b
0.5V to
a
7.0V
b
30 mA to
a
5.0 mA
Input Current (Note 2)
Voltage Applied to Output
in HIGH State (with V
CC
e
0V)
Standard Output
b
0.5V to V
CC
TRI-STATE
É
Output
b
0.5V to
a
5.5V
Current Applied to Output
in LOW State (Max) twice the rated I
OL
(mA)
Note 1: Absolute maximum ratings are values beyond which the device may
be damaged or have its useful
life impaired. Functional operation under
these conditions is not implied.
Note 2: Either voltage limit or current limit is sufficient to protect inputs.
DC Electrical Characteristics
54F/74F
Symbol
Parameter
Units
V
CC
Conditions
Min
Typ
Max
V
IH
Input HIGH Voltage
2.0
V
Recognized as a HIGH Signal
V
IL
Input LOW Voltage
0.8
V
Recognized as a LOW Signal
b
1.2
I
IN
eb
18 mA
V
CD
Input Clamp Diode Voltage
V
Min
I
OH
eb
1mA
V
OH
Output HIGH
54F 10% V
CC
2.5
Voltage
74F 10% V
CC
2.5
V
Min
I
OH
eb
1mA
I
OH
eb
1mA
74F 5% V
CC
2.7
I
OL
e
20 mA
V
OL
Output LOW
54F 10% V
CC
0.5
V
Min
Voltage
74F 10% V
CC
0.5
I
OL
e
20 mA
I
IH
Input HIGH
54F
20.0
V
IN
e
2.7V
m
A
Max
Current
74F
5.0
I
BVI
Input HIGH Current
54F
100
V
IN
e
7.0V
m
A
Max
Breakdown Test
74F
7.0
V
OUT
e
V
CC
I
CEX
Output High
54F
250
m
A
Max
Leakage Current
74F
50
V
ID
Input Leakage
I
ID
e
1.9
m
A
74F
4.75
V
0.0
Test
All Other Pins Grounded
V
IOD
e
150 mV
I
OD
Output Leakage
74F
3.75
m
A
0.0
Circuit Current
All Other Pins Grounded
I
IL
Input LOW Current
b
0.6
mA
Max
V
IN
e
0.5V
I
OS
Output Short-Circuit Current
b
60
b
150
mA
Max
V
OUT
e
0V
I
CCH
Power Supply Current
1.9
2.8
mA
Max
V
O
e
HIGH
I
CCL
Power Supply Current
3.1
4.7
mA
Max
V
O
e
LOW
2
AC Electrical Characteristics
74F
54F
74F
T
A
ea
25
§
C
T
A
,V
CC
e
Mil
T
A
,V
CC
e
Com
Symbol
Parameter
V
CC
ea
5.0V
Units
C
L
e
50 pF
C
L
e
50 pF
C
L
e
50 pF
Min
Typ
Max
Min
Max
Min
Max
t
PLH
Propagation Dela
y
2.5
4.6
6.5
2.5
8.5
2.5
7.5
ns
t
PHL
A
n
,B
n
,C
n
,D
n
to O
1.5
3.2
4.5
1.5
6.5
1.5
5.5
Ordering Information
The device number is used to form part of a simplified purchasing code where the package type and temperature range are
defined as follows:
74F
64
S
C
X
Temperature Range Family
Special Variations
74F
e
Commercial
QB
e
Military grade device with
54F
e
Military
environmental and burn-in
processing
Device Type
X
e
Devices shipped in 13
×
reel
Package Code
Temperature Range
P
e
Plastic DIP
C
e
Commercial (0
§
Cto
a
70
§
C)
D
e
Ceramic DIP
M
e
Military (
b
55
§
Cto
a
125
§
C)
F
e
Flatpak
L
e
Leadless Chip Carrier (LCC)
S
e
Small Outline SOIC
3
Physical Dimensions
inches (millimeters)
20-Lead Ceramic Leadless Chip Carrier (L)
NS Package Number E20A
14-Lead Ceramic Dual-In-Line Package (D)
NS Package Number J14A
4
Physical Dimensions
inches (millimeters) (Continued)
14-Lead (0.150
×
Wide) Molded Small Outline, JEDEC (S)
NS Package Number M14A
14-Lead (0.300
×
Wide) Molded Dual-In-Line Package (P)
NS Package Number N14A
5
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