74HC_HCT244.pdf

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74HC244; 74HCT244 Octal buffer/line driver; 3-state
74HC244; 74HCT244
Octal buffer/line driver; 3-state
Rev. 03 — 22 December 2005
Product data sheet
1. General description
The 74HC244; 74HCT244 is a high-speed Si-gate CMOS device and is pin compatible
with Low-power Schottky TTL (LSTTL).
The 74HC244; 74HCT244 has octal non-inverting buffer/line dri vers with 3-st ate outputs.
T he 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A HIGH on
nOE causes the outputs to assume a high-impedance OFF-state. The 74HC244;
74HCT244 is identical to the 74HC240; 74HCT240 but has non-inverting outputs.
2. Features
n
Octal bus interface
n
Non-inverting 3-state outputs
n
Complies with JEDEC standard no. 7A
n
ESD protection:
u
HBM EIA/JESD22-A114-C exceeds 2000 V
u
MM EIA/JESD22-A115-A exceeds 200 V
n
Multiple package options
n
Specified from
-
40
°
Cto+85
°
C and from
-
40
°
C to +125
°
C
3. Quick reference data
Table 1: Quick reference data
GND=0V; T amb =25
°
C; t r =t f =6 ns
Symbol Parameter
Conditions
Min
Typ
Max
Unit
74HC244
t PHL ,
t PLH
propagation delay
nAn to nYn
V CC =5V; C L =15pF
-
9
-
ns
C i
input capacitance
-
3.5
-
pF
C PD
power dissipation
capacitance
per buffer; V I = GND to
V CC
[1] -
35
-
pF
74HCT244
t PHL ,
t PLH
propagation delay
nAn to nYn
V CC =5V; C L =15pF
-
11
-
ns
C i
input capacitance
-
3.5
-
pF
C PD
power dissipation
capacitance
per buffer; V I = GND to
(V CC -
[1] -
35
-
pF
1.5 V)
[1] C PD is used to determine the dynamic power dissipation (P D in
m
W):
P D =C PD ´
V CC 2
´
f i ´
N+
å
(C L ´
V CC 2
´
f o ) where:
112845050.019.png 112845050.020.png 112845050.021.png 112845050.022.png
 
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
f i = input frequency in MHz;
f o = output frequency in MHz;
C L = output load capacitance in pF;
V CC = supply voltage in V;
N = number of inputs switching;
å
V CC 2
´
f o ) = sum of outputs.
4. Ordering information
Table 2: Ordering information
Type number Package
Temperature range Name
Description
Version
74HC244
74HC244N
-
40
°
C to +125
°
C
DIP20
plastic dual in-line package; 20 leads (300 mil)
SOT146-1
74HC244D
-
40
°
C to +125
°
C
SO20
plastic small outline package; 20 leads;
body width 7.5 mm
SOT163-1
74HC244DB
-
40
°
C to +125
°
C
SSOP20
plastic shrink small outline package; 20 leads;
body width 5.3 mm
SOT339-1
74HC244PW
-
40
°
C to +125
°
C
TSSOP20 plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
SOT360-1
74HC244BQ
-
40
°
C to +125
°
C
DHVQFN20 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 20 terminals;
body 2.5
SOT764-1
´
4.5
´
0.85 mm
74HCT244
74HCT244N
-
40
°
C to +125
°
C
DIP20
plastic dual in-line package; 20 leads (300 mil)
SOT146-1
74HCT244D
-
40
°
C to +125
°
C
SO20
plastic small outline package; 20 leads;
body width 7.5 mm
SOT163-1
74HCT244DB
-
40
°
C to +125
°
C
SSOP20
plastic shrink small outline package; 20 leads;
body width 5.3 mm
SOT339-1
74HCT244PW
-
40
°
C to +125
°
C
TSSOP20 plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
SOT360-1
74HCT244BQ
-
40
°
C to +125
°
C
DHVQFN20 plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 20 terminals;
body 2.5
SOT764-1
´
4.5
´
0.85 mm
74HC_HCT244_3
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 22 December 2005
2 of 22
(C L ´
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Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
5. Functional diagram
2
1A0
1Y0
18
4
1A1
1Y1
16
6
1A2
1Y2
14
8
1A3
1Y3
12
1
1OE
17
2A0
2Y0
3
15
2A1
2Y1
5
13
2A2
2Y2
7
11
2A3
2Y3
9
19
2OE
mna875
Fig 1. Functional diagram
1
EN
1A0
2
18
1Y0
2A0
17
3
2Y0
2
18
4
6
8
16
4
16
15
5
14
1A1
1Y1
2A1
2Y1
12
1A2
6
14
1Y2
2A2
13
7
2Y2
19
EN
1A3
8
12
1Y3
2A3
11
9
2Y3
11
9
1OE
1
2OE
19
13
15
17
7
mna874
5
3
mna873
Fig 2. Logic symbol
Fig 3. IEC logic symbol
74HC_HCT244_3
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 22 December 2005
3 of 22
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Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
6. Pinning information
6.1 Pinning
74HC244
74HCT244
terminal 1
index area
74HC244
74HCT244
1A0
2
19
2OE
2Y0
3
18
1Y0
1OE
1
2
3
4
5
6
7
8
9
10
20
19
V CC
1A1
4
17
2A0
1A0
2OE
2Y0
18
17
1Y0
2Y1
5
16
1Y1
1A1
2A0
1A2
6
15
2A1
2Y1
16
15
1Y1
2Y2
7
14
1Y2
1A2
2A1
1A3
8
GND (1)
13
2A2
2Y2
14
13
1Y2
9
12
2Y3
1Y3
1A3
2A2
2Y3
12
11
1Y3
GND
2A3
001aae012
001aae011
Transparent top view
(1) The die substrate is attached to this
pad using conductive die attach
material. It can not be used as supply
pin or input
Fig 4. Pin configuration DIP20, SO20,
SSOP20 and TSSOP20
Fig 5. Pin configuration DHVQFN20
6.2 Pin description
Table 3: Pin description
Symbol
Pin
Description
1OE
1
1 output enable input (active LOW)
1A0
2
1 data input 0
2Y0
3
2 bus output 0
1A1
4
1 data input 1
2Y1
5
2 bus output 1
1A2
6
1 data input 2
2Y2
7
2 bus output 2
1A3
8
1 data input 3
2Y3
9
2 bus output 3
GND
10
ground (0 V)
2A3
11
2 data input 3
1Y3
12
1 bus output 3
2A2
13
2 data input 2
1Y2
14
1 bus output 2
74HC_HCT244_3
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 22 December 2005
4 of 22
112845050.010.png 112845050.011.png 112845050.012.png 112845050.013.png 112845050.014.png
 
Philips Semiconductors
74HC244; 74HCT244
Octal buffer/line driver; 3-state
Table 3: Pin description …continued
Symbol
Pin
Description
2A1
15
2 data input 1
1Y1
16
1 bus output 1
2A0
17
2 data input 0
1Y0
18
1 bus output 0
2OE
19
2 output enable input (active LOW)
V CC
20
supply voltage
7. Functional description
7.1 Function table
Table 4: Function table [1]
Control
Input
Output
nOE
nAn
nYn
L
L
L
H
H
H
X
Z
[1] H = HIGH voltage level;
L = LOW voltage level;
X = don’t care;
Z = high-impedance OFF-state.
8. Limiting values
Table 5: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to
GND (ground = 0 V).
Symbol Parameter
Conditions
Min Max Unit
V CC
supply voltage
-
0.5 +7
V
I IK
input clamping current
V I <
-
0.5 V or V I >V CC + 0.5 V
-
±
20
mA
I OK
output clamping current
0.5 V or
V O >V CC + 0.5 V
-
-
±
20
mA
I O
output current
V O =
-
0.5 V to (V CC + 0.5 V)
-
±
35
mA
I CC
quiescent supply current
-
70
mA
I GND
ground current
-
-
70
mA
T stg
storage temperature
-
65
+150
C
P tot
total power dissipation
DIP20 package
[1] -
750 mW
SO20 package
[2] -
500 mW
SSOP20 package
[3] -
500 mW
TSSOP20 package
[3] -
500 mW
DHVQFN20 package
[4] -
500 mW
74HC_HCT244_3
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 03 — 22 December 2005
5 of 22
V O <
°
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