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LM35/LM35A/LM35C/LM35CA/LM35D Precision Centigrade Temperature Sensors
December 1994
LM35/LM35A/LM35C/LM35CA/LM35D
Precision Centigrade Temperature Sensors
General Description
The LM35 series are precision integrated-circuit tempera-
ture sensors, whose output voltage is linearly proportional to
the Celsius (Centigrade) temperature. The LM35 thus has
an advantage over linear temperature sensors calibrated in
§
Kelvin, as the user is not required to subtract a large con-
stant voltage from its output to obtain convenient Centi-
grade scaling. The LM35 does not require any external cali-
bration or trimming to provide typical accuracies of
g
(/4
§
C
at room temperature and
g
*/4
§
C over a full
b
55 to
a
150
§
C
temperature range. Low cost is assured by trimming and
calibration at the wafer level. The LM35's low output imped-
ance, linear output, and precise inherent calibration make
interfacing to readout or control circuitry especially easy. It
can be used with single power supplies, or with plus and
minus supplies. As it draws only 60
m
A from its supply, it has
very low self-heating, less than 0.1
§
C in still air. The LM35 is
rated to operate over a
b
55
§
to
a
150
§
C temperature
range, while the LM35C is rated for a
b
40
§
to
a
110
§
C
range (
b
10
§
with improved accuracy). The LM35 series is
available packaged in hermetic TO-46 transistor packages,
while the LM35C, LM35CA, and LM35D are also available in
the plastic TO-92 transistor package. The LM35D is also
available in an 8-lead surface mount small outline package
and a plastic TO-202 package.
Features
Y
Calibrated directly in
§
Celsius (Centigrade)
Y
Linear
a
10.0 mV/
§
C scale factor
Y
0.5
§
C accuracy guaranteeable (at
a
25
§
C)
Y
Rated for full
b
55
§
to
a
150
§
C range
Y
Suitable for remote applications
Y
Low cost due to wafer-level trimming
Y
Operates from 4 to 30 volts
Y
Less than 60
m
A current drain
Y
Low self-heating, 0.08
§
C in still air
Y
Nonlinearity only
g
(/4
§
C typical
Y
Low impedance output, 0.1
X
for 1 mA load
Connection Diagrams
TO-46
Metal Can Package*
TO-92
Plastic Package
SO-8
Small Outline Molded Package
TL/H/5516±2
TL/H/5516±1
*Case is connected to negative pin (GND)
TL/H/5516±21
Order Number LM35CZ,
LM35CAZ or LM35DZ
See NS Package Number Z03A
Top View
N.C.
e
No Connection
Order Number LM35H, LM35AH,
LM35CH, LM35CAH or LM35DH
See NS Package Number H03H
Order Number LM35DM
See NS Package Number M08A
TO-202
Plastic Package
Typical Applications
TL/H/5516±3
FIGURE 1. Basic Centigrade
Temperature
Sensor (
a
2
§
Cto
a
150
§
C)
TL/H/5516±4
Choose R
1
eb
V
S
/50
m
A
V
OUT
ea
1,500 mV at
a
150
§
C
ea
250 mV at
a
25
§
C
eb
550 mV at
b
55
§
C
FIGURE 2. Full-Range Centigrade
Temperature Sensor
TL/H/5516±24
Order Number LM35DP
See NS Package Number P03A
TRI-STATE
É
is a registered trademark of National Semiconductor Corporation.
C
1995 National Semiconductor Corporation
TL/H/5516
RRD-B30M75/Printed in U. S. A.
Absolute Maximum Ratings
(Note 10)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales
Office/Distributors for availability and specifications.
Supply Voltage
a
35V to
b
0.2V
Output Voltage
a
6V to
b
1.0V
Output Current 10 mA
Storage Temp., TO-46 Package,
b
60
§
Cto
a
180
§
C
TO-92 Package,
b
60
§
Cto
a
150
§
C
SO-8 Package,
b
65
§
Cto
a
150
§
C
TO-202 Package,
b
65
§
Cto
a
150
§
C
SO Package (Note 12):
Vapor Phase (60 seconds) 215
§
C
Infrared (15 seconds) 220
§
C
ESD Susceptibility (Note 11) 2500V
Specified Operating Temperature Range: T
MIN
to T
MAX
(Note 2)
LM35, LM35A
b
55
§
Cto
a
150
§
C
LM35C, LM35CA
b
40
§
Cto
a
110
§
C
LM35D
0
§
Cto
a
100
§
C
Lead Temp.:
TO-46 Package, (Soldering, 10 seconds) 300
§
C
TO-92 Package, (Soldering, 10 seconds) 260
§
C
TO-202 Package, (Soldering, 10 seconds)
a
230
§
C
Electrical Characteristics
(Note 1) (Note 6)
LM35A
LM35CA
Parameter
Conditions
Tested Design
Tested Design Units
Typical Limit
Limit Typical Limit
Limit
(Max.)
(Note 4) (Note 5)
(Note 4) (Note 5)
Accuracy
T
A
ea
25
§
C
g
0.2
g
0.5
g
0.2
g
0.5
§
C
(Note 7)
T
A
eb
10
§
C
g
0.3
g
0.3
g
1.0
§
C
T
A
e
T
MAX
g
0.4
g
1.0
g
0.4
g
1.0
§
C
T
A
e
T
MIN
g
0.4
g
1.0
g
0.4
g
1.5
§
C
Nonlinearity
T
MIN
s
T
A
s
T
MAX
g
0.18
g
0.35
g
0.15
g
0.3
§
C
(Note 8)
Sensor Gain
T
MIN
s
T
A
s
T
MAX
a
10.0
a
9.9,
a
10.0
a
9.9, mV/
§
C
(Average Slope)
a
10.1
a
10.1
Load Regulation
T
A
ea
25
§
C
g
0.4
g
1.0
g
0.4
g
1.0
mV/mA
(Note 3) 0
s
I
L
s
1mA T
MIN
s
T
A
s
T
MAX
g
0.5
g
3.0
g
0.5
g
3.0 mV/mA
Line Regulation
T
A
ea
25
§
C
g
0.01
g
0.05
g
0.01
g
0.05
mV/V
(Note 3)
4V
s
V
S
s
30V
g
0.02
g
0.1
g
0.02
g
0.1 mV/V
Quiescent Current
V
S
ea
5V,
a
25
§
C
56
67
56
67
m
A
(Note 9)
V
S
ea
5V
105
131 91
114
m
A
V
S
ea
30V,
a
25
§
C 56.2
68
56.2
68
m
A
V
S
ea
30V
105.5
133 91.5
116
m
A
Change of
4V
s
V
S
s
30V,
a
25
§
C 0.2
1.0
0.2
1.0
m
A
Quiescent Current
4V
s
V
S
s
30V
0.5
2.0 0.5
2.0
m
A
(Note 3)
Temperature
a
0.39
a
0.5
a
0.39
a
0.5
m
A/
§
C
Coefficient of
Quiescent Current
Minimum Temperature In circuit of
a
1.5
a
2.0
a
1.5
a
2.0
§
C
for Rated Accuracy Figure1,I
L
e
0
Long Term Stability
T
J
e
T
MAX
, for
g
0.08
g
0.08
§
C
1000 hours
Note 1: Unless otherwise noted, these specifications apply:
b
55
§
C
s
T
J
s
a
150
§
C for the LM35 and LM35A;
b
40
§
s
T
J
s
a
110
§
C for the LM35C and LM35CA; and
0
§
s
T
J
s
a
100
§
C for the LM35D. V
S
ea
5Vdc and I
LOAD
e
50
m
A, in the circuit of Figure2. These specifications also apply from
a
2
§
CtoT
MAX
in the circuit of
Figure1. Specifications in boldface apply over the full rated temperature range.
Note 2: Thermal resistance of the TO-46 package is 400
§
C/W, junction to ambient, and 24
§
C/W junction to case. Thermal resistance of the TO-92 package is
180
§
C/W junction to ambient. Thermal resistance of the small outline molded package is 220
§
C/W junction to ambient. Thermal resistance of the TO-202 package
is 85
§
C/W junction to ambient. For additional thermal resistance information see table in the Applications section.
2
Electrical Characteristics
(Note 1) (Note 6) (Continued)
LM35
LM35C, LM35D
Parameter
Conditions
Tested Design
Tested Design Units
Typical Limit
Limit Typical Limit
Limit
(Max.)
(Note 4) (Note 5)
(Note 4) (Note 5)
Accuracy,
T
A
ea
25
§
C
g
0.4
g
1.0
g
0.4
g
1.0
§
C
LM35, LM35C
T
A
eb
10
§
C
g
0.5
g
0.5
g
1.5
§
C
(Note 7)
T
A
e
T
MAX
g
0.8
g
1.5
g
0.8
g
1.5
§
C
T
A
e
T
MIN
g
0.8
g
1.5
g
0.8
g
2.0
§
C
Accuracy,
T
A
ea
25
§
C
g
0.6
g
1.5
§
C
LM35D
T
A
e
T
MAX
g
0.9
g
2.0
§
C
(Note 7)
T
A
e
T
MIN
g
0.9
g
2.0
§
C
Nonlinearity
T
MIN
s
T
A
s
T
MAX
g
0.3
g
0.5
g
0.2
g
0.5
§
C
(Note 8)
Sensor Gain
T
MIN
s
T
A
s
T
MAX
a
10.0
a
9.8,
a
10.0
a
9.8, mV/
§
C
(Average Slope)
a
10.2
a
10.2
Load Regulation
T
A
ea
25
§
C
g
0.4
g
2.0
g
0.4
g
2.0
mV/mA
(Note 3) 0
s
I
L
s
1mA T
MIN
s
T
A
s
T
MAX
g
0.5
g
5.0
g
0.5
g
5.0 mV/mA
Line Regulation
T
A
ea
25
§
C
g
0.01
g
0.1
g
0.01
g
0.1
mV/V
(Note 3)
4V
s
V
S
s
30V
g
0.02
g
0.2
g
0.02
g
0.2 mV/V
Quiescent Current
V
S
ea
5V,
a
25
§
C
56
80
56
80
m
A
(Note 9)
V
S
ea
5V
105
158 91
138
m
A
V
S
ea
30V,
a
25
§
C 56.2
82
56.2
82
m
A
V
S
ea
30V
105.5
161 91.5
141
m
A
Change of
4V
s
V
S
s
30V,
a
25
§
C 0.2
2.0
0.2
2.0
m
A
Quiescent Current
4V
s
V
S
s
30V
0.5
3.0 0.5
3.0
m
A
(Note 3)
Temperature
a
0.39
a
0.7
a
0.39
a
0.7
m
A/
§
C
Coefficient of
Quiescent Current
Minimum Temperature In circuit of
a
1.5
a
2.0
a
1.5
a
2.0
§
C
for Rated Accuracy Figure1,I
L
e
0
Long Term Stability
T
J
e
T
MAX
, for
g
0.08
g
0.08
§
C
1000 hours
Note 3: Regulation is measured at constant junction temperature, using pulse testing with a low duty cycle. Changes in output due to heating effects can be
computed by multiplying the internal dissipation by the thermal resistance.
Note 4: Tested Limits are guaranteed and 100% tested in production.
Note 5: Design Limits are guaranteed (but not 100% production tested) over the indicated temperature and supply voltage ranges. These limits are not used to
calculate outgoing quality levels.
Note 6: Specifications in boldface apply over the full rated temperature range.
Note 7: Accuracy is defined as the error between the output voltage and 10mv/
§
C times the device's case temperature, at specified conditions of voltage, current,
and temperature (expressed in
§
C).
Note 8: Nonlinearity is defined as the deviation of the output-voltage-versus-temperature curve from the best-fit straight line, over the device's rated temperature
range.
Note 9: Quiescent current is defined in the circuit of Figure1.
Note 10: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when
operating the device beyond its rated operating conditions. See Note 1.
Note 11: Human body model, 100 pF discharged through a 1.5 k
X
resistor.
Note 12: See AN-450 ``Surface Mounting Methods and Their Effect on Product Reliability'' or the section titled ``Surface Mount'' found in a current National
Semiconductor Linear Data Book for other methods of soldering surface mount devices.
3
Typical Performance Characteristics
Thermal Resistance
Junction to Air
Thermal Time Constant
Thermal Response
in Still Air
Thermal Response in
Stirred Oil Bath
Minimum Supply
Voltage vs. Temperature
Quiescent Current
vs. Temperature
(In Circuit of Figure1.)
TL/H/5516±17
Quiescent Current
vs. Temperature
(In Circuit of Figure2.)
Accuracy vs. Temperature
(Guaranteed)
Accuracy vs. Temperature
(Guaranteed)
TL/H/5516±18
Noise Voltage
Start-Up Response
TL/H/5516±22
4
Applications
The LM35 can be applied easily in the same way as other
integrated-circuit temperature sensors. It can be glued or
cemented to a surface and its temperature will be within
about 0.01
§
C of the surface temperature.
This presumes that the ambient air temperature is almost
the same as the surface temperature; if the air temperature
were much higher or lower than the surface temperature,
the actual temperature of the LM35 die would be at an inter-
mediate temperature between the surface temperature and
the air temperature. This is expecially true for the TO-92
plastic package, where the copper leads are the principal
thermal path to carry heat into the device, so its tempera-
ture might be closer to the air temperature than to the sur-
face temperature.
To minimize this problem, be sure that the wiring to the
LM35, as it leaves the device, is held at the same tempera-
ture as the surface of interest. The easiest way to do this is
to cover up these wires with a bead of epoxy which will
insure that the leads and wires are all at the same tempera-
ture as the surface, and that the LM35 die's temperature will
not be affected by the air temperature.
The TO-46 metal package can also be soldered to a metal
surface or pipe without damage. Of course, in that case the
V
b
terminal of the circuit will be grounded to that metal.
Alternatively, the LM35 can be mounted inside a sealed-end
metal tube, and can then be dipped into a bath or screwed
into a threaded hole in a tank. As with any IC, the LM35 and
accompanying wiring and circuits must be kept insulated
and dry, to avoid leakage and corrosion. This is especially
true if the circuit may operate at cold temperatures where
condensation can occur. Printed-circuit coatings and var-
nishes such as Humiseal and epoxy paints or dips are often
used to insure that moisture cannot corrode the LM35 or its
connections.
These devices are sometimes soldered to a small light-
weight heat fin, to decrease the thermal time constant and
speed up the response in slowly-moving air. On the other
hand, a small thermal mass may be added to the sensor, to
give the steadiest reading despite small deviations in the air
temperature.
Temperature Rise of LM35 Due To Self-heating (Thermal Resistance)
TO-46, TO-46, TO-92, TO-92, SO-8 SO-8 TO-202 TO-202 ***
no heat sink small heat fin* no heat sink small heat fin** no heat sink small heat fin** no heat sink small heat fin
Still air
400
§
C/W 100
§
C/W 180
§
C/W 140
§
C/W 220
§
C/W 110
§
C/W 85
§
C/W 60
§
C/W
Moving air
100
§
C/W 40
§
C/W 90
§
C/W 70
§
C/W 105
§
C/W 90
§
C/W 25
§
C/W 40
§
C/W
Still oil
100
§
C/W 40
§
C/W 90
§
C/W 70
§
C/W
Stirred oil
50
§
C/W 30
§
C/W 45
§
C/W 40
§
C/W
(Clamped to metal,
Infinite heat sink)
(24
§
C/W)
(55
§
C/W)
(23
§
C/W)
* Wakefield type 201, or 1
×
disc of 0.020
×
sheet brass, soldered to case, or similar.
** TO-92 and SO-8 packages glued and leads soldered to 1
×
square of
(/16
×
printed circuit board with 2 oz. foil or similar.
Typical Applications
(Continued)
TL/H/5516±19
FIGURE 3. LM35 with Decoupling from Capacitive Load
TL/H/5516±20
FIGURE 4. LM35 with R-C Damper
CAPACITIVE LOADS
Like most micropower circuits, the LM35 has a limited ability
to drive heavy capacitive loads. The LM35 by itself is able to
drive 50 pf without special precautions. If heavier loads are
anticipated, it is easy to isolate or decouple the load with a
resistor; see Figure3. Or you can improve the tolerance of
capacitance with a series R-C damper from output to
ground; see Figure4.
When the LM35 is applied with a 200
X
load resistor as
shown in Figure5,6, or 8, it is relatively immune to wiring
capacitance because the capacitance forms a bypass from
ground to input, not on the output. However, as with any
linear circuit connected to wires in a hostile environment, its
performance can be affected adversely by intense electro-
magnetic sources such as relays, radio transmitters, motors
with arcing brushes, SCR transients, etc, as its wiring can
act as a receiving antenna and its internal junctions can act
as rectifiers. For best results in such cases, a bypass capac-
itor from V
IN
to ground and a series R-C damper such as
75
X
in series with 0.2 or 1
m
F from output to ground are
often useful. These are shown in Figures13,14, and 16.
5
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