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Texas Instruments Incorporated
Data Acquisition
A DAC for all precision occasions
By Bonnie C. Baker, Senior Applications Engineer
Introduction
Analog-to-digital converters (ADC) routinely
convert analog signals such as temperature,
pressure, sound, or images to a precise digital
representation. Microcontrollers and micro-
processors store, massage, and transmit this
digital information throughout a system. There
are also times when precision digital-to-analog
converters (DAC) convert the digital representa-
tion of these real-world events back into the
analog domain. Three of the DAC topologies that
achieve this feat are the R-2R MDAC, R-2R back-
DAC, and the string DAC. These three topolo-
gies service applications such as automatic test
equipment, instrumentation, portable equip-
ment, and digitally controlled calibration.
The R-2R MDAC
Automatic test equipment or instrumentation typically
uses the R-2R multiplying DAC (MDAC, Figure 1). The
external operational amplifier augments the DAC function
by providing the opportunity for differing supply voltages
and high output currents. MDAC manufacturers are able
to design high resolution devices (16 bit) with ±1 LSB
integral non-linearity (INL) and differential non-linearity
(DNL) specifications. With an appropriate external ampli-
fier, the MDAC exhibits fast settling time (< 0.3 ms) with
a multiplying bandwidth that can be greater than 10 MHz.
The MDAC generates a current that is proportional to
an input digital code. The external amplifier, along with
R FB (internal in the MDAC), converts the DAC’s current-
output signal to a usable voltage level. It would seem that
a simple current-to-voltage conversion is easy to imple-
ment with a DAC, an amplifier, and a resistor. However,
this application circuit has a set of stability issues.
Figure 1. An R-2R multiplying DAC
R
R
R
V REF
2R
2R
2R
2R
2R
R FB
MSB
LSB
External
Op Amp
The output model of the MDAC contains a current
source, variable resistor, and variable capacitor (Figure 2a).
The output resistance and capacitance of the MDAC is
dependent on the input code to the DAC. Programming
the MDAC to zero causes the output resistance (R D ) to be
near infinite. If you program the MDAC to full scale or all
ones, R D is equal to R FB . The output capacitance (C D )
changes according to the number of internal gate-source
junctions across the MDAC output. At full scale, the
MDAC output capacitance is equal to the data sheet
specification. When programmed to zero scale, the MDAC
output capacitance is equal to approximately half the
full-scale value. As we calculate the worst-case stability
condition, we will use the full-scale output values of R D
and C D .
To maintain precision, most MDACs have a feedback
resistor (R FB ) on-chip. The feedback capacitor, C F , is
external and discrete. The unity gain bandwidth (f U ) of
Figure 2a. MDAC model
I DAC
+5 V
C F
R FB
+5 V
C CM
R D
C D
OPA
V OUT
C DIF
C CM
MDAC
–5 V
5
Analog Applications Journal
3Q 2008
High-Performance Analog Products
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Data Acquisition
Texas Instruments Incorporated
the operational amplifier, as well as the input-differential
capacitance (C DIF ) and common-mode capacitance (C CM ),
directly affect the stability of this circuit.
At the input of the amplifier, the total capacitance in
this system is equal to C IN = C D + C DIF + C CM . The pole
and zero in the feedback loop of the amplifier are equal
to (see Figure 2b and c):
Figure 2b. Model’s frequency response
with a high-bandwidth amplifier
Op Amp Open-Loop Gain (A OL )
1
f
=
Critical
Intersection
[feedback circuit zero]
1
2
π
(
CC R
)
(
|| R
)
1
IN
F
D
F
f 1 = 2
π
(C IN + C F )×(R F || R D )
1
Op Amp Closed-Loop Gain
f
=
[feedback circuit pole]
f U1
2
2
π(
CC
IN
+
)
F
1
Frequency (Hz)
f 2 = 2
You determine the system stability by keeping the
difference of the rate of change of the operational
amplifier open-loop gain curve and the closed-loop gain
curve at 20 dB/decade. You can do this by selecting an
amplifier with unity gain bandwidth (f U ) less than f 1 or
higher than f 2 (Figure 2b and c).
From here, it is easy to design a stable circuit. If f 1 is
higher than the unity gain crossing of the amplifier f U ,
the following formula applies to this design.
π
C F R F
Figure 2c. Model’s frequency response
with a low-bandwidth amplifier
Op Amp Open-Loop Gain (A OL )
118
2
++
π
πR FU
CRf
IN
F U
C
F
1
f 1 =
If f 2 is lower than the intersection of the open-loop gain
curve and the closed-loop gain curve, use this formula.
2
π
(C IN + C F )×(R F || R D )
Op Amp Closed-Loop Gain
1
f 2 = 2
1
π
C F R F
C
C
F
IN
2
π
(|| R FU
R
Frequency (Hz)
f U2
D
Critical
Intersection
These calculated values of C F are a starting point. As
you test your circuit, parasitics, device manufacturing
variations, etc. can prompt you to modify the value of C F .
Making the MDAC analog voltage signal stable is criti-
cal. However, there are other issues to take into account.
At the risk of covering this topic too briefly, consider
issues such as amplifier noise, input bias current, and off-
set voltage, as well as MDAC resolution and glitch energy.
The MDAC is a low-noise solution for a variety of appli-
cations. The voltage-reference, current-output change
with digital codes to the MDAC is constant. The trade-off
for this advantage is varying ground currents with digital
input codes. Typically, you will find MDACs in digital gain
and attenuation control circuits as well as waveform
generators.
The R-2R back-DAC
You usually use the R-2R back-DAC (Figure 3) in industrial
applications. Some other applications for the R-2R
back-DAC include instrumentation and digitally controlled
calibration. With the R-2R back-DAC, each new update
switches the 2R legs to either the voltage reference high
(VREF-H) or the voltage reference low (VREF-L). Notice
that the arrangement of the R-2R ladder is upside down
as compared to the MDAC. This is where the name
“back-DAC” came from. This architecture is simple to
Figure 3. An R-2R Back-DAC
Analog
Output
R
R
R
(V OUT )
2R
2R
2R
2R
2R
LSB
MSB
V REF-H
V REF-L
manufacture, assuming the resistors for each current
source can be properly adjusted.
Gate-switch timing skews manifest themselves at the
output of the MDAC and back-DAC as glitches. The glitch
is most prevalent during the MSB transition, when bits are
6
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Texas Instruments Incorporated
Data Acquisition
extent that it appears as if the DAC is momentarily
non-monotonic. Secondary glitches occur around the
one-fourth full-scale and three-fourths full-scale voltages.
If the control system is fast enough to respond to this
glitch, the circuit may oscillate.
You can try to reduce the impact of this glitch impulse
by using a low-pass filter at the output of the DAC.
However, while a low-pass filter reduces the glitch-impulse
amplitude, it increases the glitch time. For example,
consider a glitch-impulse response of the 16-bit DAC
is equal to 96 nV-s, with a peak voltage of 60 mV and
duration of 1.6 µs. You can filter this glitch impulse so that
the peak voltage is 30 mV with duration of 3.2 µs. You can
also add sampling circuitry on the output of the DAC and
time it with DAC conversions. This technique may work
for lower resolution, slow DACs; however, the sampling
mechanism may create more problems by adding to the
analog errors and conversion time. The best way to over-
come larger glitch impulses is to select a string DAC with
lower glitch-impulse errors from the start.
The R-2R back-DAC has medium settling time capability;
however, you can build high-performance circuits with its
superior INL and DNL performance. Texas Instruments
achieves higher accuracy specifications with final test
trimming. The R-2R ladder also facilitates low-noise per-
formance from the DAC.
String DAC topology
The string DAC is best suited for portable instrumenta-
tion, closed-loop servo control, and process control.
Figure 5 shows a model of a 3-bit string DAC. In this
figure, the digital input code 101b is decoded to 5/8 V REF .
The string DAC’s output-stage amplifier isolates the
internal resistive elements from output loads. The string
DAC is a low-power solution that guarantees monotonicity
Figure 4a. Glitch impulse of a DAC producing
two regions of code transition error
Voltage (V)
Glitch-Impulse
Area, G 2
Code: 8000
Code: 7FFF
Time (s)
Glitch-Impulse
Area, G 1
Glitch-Impulse = G 2 – G 1
Figure 4b. Glitch impulse of DAC
producing one region of overshoot
Glitch-Impulse
Area, G 1
Voltage (V)
Code: 8000
Code: 7FFF
Time (s)
Glitch-Impulse = G 1
switching from 7FFFh to 8000h (for a 16-bit DAC). The
R-2R back-DAC, like the MDAC, typically has excellent
low noise, INL, and DNL performance, with medium
settling-time capability.
DAC glitches result from capacitive-charge injection
from the internal, asynchronous gate switching. The DAC
glitch for R-2R DACs typically has two lobes (Figure 4a),
while string topologies typically have a single-lobe glitch
impulse (Figure 4b).
The units of a glitch impulse is volts/seconds. Glitch
impulses are most dramatic between consecutive codes
where a major code transition occurs. In Figure 4a the
total glitch impulse equals G 2 minus G 1 , where G 1 and G 2
are the calculated areas. In Figure 4b the total glitch
impulse equals the shaded area of G 1 . In most systems,
you can ignore the glitches that occur at the output of a
DAC during code transition; however, in a control loop,
glitch impulses are typically undesirable. In a control sys-
tem, the DAC glitch impulse from a one-bit code transi-
tion, where the MSB is switching, confuses the loop by
momentarily sending an erroneous output-voltage signal.
The glitch-impulse area in Figure 4a occurs during the
DAC’s output-voltage transition region as it switches from
one code to another. As the 16-bit DAC switches from
8000h to 7FFFh (or half the full-scale output voltage),
the output glitch impulse becomes noticeable to the
Figure 5. String DAC topology
V RE F
R
7/8 V REF
1
0
R
6/8 V REF
1
0
R
5/8 V REF
1
0
R
4/8 V REF
1
0
R
V OUT
3/8 V REF
1
0
R
2/8 V REF
V FB
1
0
R
1/8 V REF
1
0
R
0 V
Digital Input Code
1
0
1
LSB
MSB
7
Analog Applications Journal
3Q 2008
High-Performance Analog Products
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Data Acquisition
Texas Instruments Incorporated
with good DNL performance across the entire input code
range. The glitch energy is typically lower than other
types of DACs; however, the INL performance is generally
larger and dependent on resistive, on-chip matching. On
the other hand, a DAC in a control loop lessens the impact
of high linearity. The noise of string DACs is also relatively
high because of the resistive string-array impedance.
The string DAC operates with low power and very low
glitch energy. An on-chip output buffer simplifies the
interface to this device.
DAC calibration
With any of the three DACs in this article, you may see
a need to calibrate the analog output for higher precision
results. If you calibrate any DAC, you initially determine
the code-to-voltage error at one-third of the output range
and again at two-thirds of the output range. The range
between one-third full scale (FS) and two-thirds FS avoids
the output amplifier errors near the power supply rails.
You achieve the calibration of the offset and gain errors
with the formula V OUT = a +bV IN (“a” is the offset error
and “b” is the gain error). You can calibrate your DAC in
the digital domain with the help of an ADC that is more
accurate than the target specifications of a DAC.
A more challenging DAC calibration activity is to adjust
the linearity of the converter’s entire output range. Once
again, you will require an ADC that has four times the
resolution of the DAC. You can calibrate every DAC code
with 8, 10, or 12 bits of resolution. In this environment
there are fewer DAC codes to calibrate and the memory
requirements are lower. The accuracy of the calibrating
low-bit ADC is not as demanding, allowing faster ADC
conversion times. For DACs with resolution of 14+ bits,
the total number of codes becomes unmanageable in
terms of processor memory. Additionally, you will need to
use a slower ADC with higher accuracy, such as a delta-
sigma converter. Higher cost and slower speeds will
encourage you to consider alternative DAC calibration
strategies.
An effective alternative to linearizing every DAC code is to
select several small groups of codes. The plot in Figure 6a
shows an example of the integral non-linearity of a 16-bit
string DAC. The universal formula for calculating any DAC
correction code is
Figure 6a. INL of a 16-bit string DAC
30
20
10
0
–10
–20
–30
–40
–50
–60
0
10K
20K
30K
40K
50K
60K 65K
DAC Code
Figure 6b. A correction step of 64 LSB (1024 out
of the 65,536 points) reduces the INL error to less
than ± 3 LSB
8
6
4
2
0
–2
–4
–6
–8
0
10K
20K
30K
40K
50K
60K 65K
DAC Code
next, as may be with R-2R architectures, this technique
may prove to be counterproductive instead of an improve-
ment in DAC performance. The string DAC topology is
best suited for this calibration technique because it is
inherently monotonic (a requirement for this technique)
and jumps from one code to the next are relatively small
as compared to other DAC topologies.
Conclusion
A precision DAC uses a limited number of discrete digital
input codes to produce a corresponding number of discrete
analog output values. For a DAC, 1 LSB corresponds to
the height of a step between successive analog outputs,
with the value defined in the same way as for the ADC.
The MDAC, R-2R back-DAC, and string DAC architectures
do not encompass all of the possible DAC topologies, but if
you know about these topologies you will have a good
start on knowing the basics.
Related Web sites
vx
vw
DAC
=
INL
+
(
INL
INL
)
×
,
COR
V
V
W
where INL V and INL W are the INL error of the v and w
code. x is a code between codes v and w. If (v – w) is
equal to an integer that is a power of two, you can imple-
ment the division with right shifts, reducing the processor
calculation time and complexity. Figure 6b illustrates the
benefit of this linearization technique using 1024 code
groupings, 64 codes per group.
This technique is best suited for DACs that are mono-
tonic, with INL error in excess of ±8 LSB. Additionally,
you must exercise care when selecting the size of the code
sets. If there are large, sudden jumps from one code to the
8
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SLYT300
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