74HC_HCT244.pdf

74HC244; 74HCT244

Octal buffer/line driver; 3-state

Rev. 03 — 22 December 2005

Product data sheet

1. General description

The 74HC244; 74HCT244 is a high-speed Si-gate CMOS device and is pin compatible

with Low-power Schottky TTL (LSTTL).

The 74HC244; 74HCT244 has octal non-inverting buffer/line dri vers with 3-st ate outputs.

T he 3-state outputs are controlled by the output enable inputs 1OE and 2OE. A HIGH on

nOE causes the outputs to assume a high-impedance OFF-state. The 74HC244;

74HCT244 is identical to the 74HC240; 74HCT240 but has non-inverting outputs.

2. Features

Octal bus interface

Non-inverting 3-state outputs

Complies with JEDEC standard no. 7A

ESD protection:

HBM EIA/JESD22-A114-C exceeds 2000 V

MM EIA/JESD22-A115-A exceeds 200 V

Multiple package options

Speciﬁed from

Cto+85

C and from

C to +125

3. Quick reference data

Table 1: Quick reference data

GND=0V; T amb =25

C; t r =t f =6 ns

Symbol Parameter

Conditions

Min

Typ

Max

Unit

74HC244

t PHL ,

t PLH

propagation delay

nAn to nYn

V CC =5V; C L =15pF

C i

input capacitance

3.5

C PD

power dissipation

capacitance

per buffer; V I = GND to

V CC

[1] -

74HCT244

t PHL ,

t PLH

propagation delay

nAn to nYn

V CC =5V; C L =15pF

C i

input capacitance

3.5

C PD

power dissipation

capacitance

per buffer; V I = GND to

(V CC -

[1] -

1.5 V)

[1] C PD is used to determine the dynamic power dissipation (P D in

W):

P D =C PD ´

V CC 2

f i ´

N+

(C L ´

V CC 2

f o ) where:

Philips Semiconductors

74HC244; 74HCT244

Octal buffer/line driver; 3-state

f i = input frequency in MHz;

f o = output frequency in MHz;

C L = output load capacitance in pF;

V CC = supply voltage in V;

N = number of inputs switching;

V CC 2

f o ) = sum of outputs.

4. Ordering information

Table 2: Ordering information

Type number Package

Temperature range Name

Description

Version

74HC244

74HC244N

C to +125

DIP20

plastic dual in-line package; 20 leads (300 mil)

SOT146-1

74HC244D

C to +125

SO20

plastic small outline package; 20 leads;

body width 7.5 mm

SOT163-1

74HC244DB

C to +125

SSOP20

plastic shrink small outline package; 20 leads;

body width 5.3 mm

SOT339-1

74HC244PW

C to +125

TSSOP20 plastic thin shrink small outline package; 20 leads;

body width 4.4 mm

SOT360-1

74HC244BQ

C to +125

DHVQFN20 plastic dual in-line compatible thermal enhanced very

thin quad ﬂat package; no leads; 20 terminals;

body 2.5

SOT764-1

4.5

0.85 mm

74HCT244

74HCT244N

C to +125

DIP20

plastic dual in-line package; 20 leads (300 mil)

SOT146-1

74HCT244D

C to +125

SO20

plastic small outline package; 20 leads;

body width 7.5 mm

SOT163-1

74HCT244DB

C to +125

SSOP20

plastic shrink small outline package; 20 leads;

body width 5.3 mm

SOT339-1

74HCT244PW

C to +125

TSSOP20 plastic thin shrink small outline package; 20 leads;

body width 4.4 mm

SOT360-1

74HCT244BQ

C to +125

DHVQFN20 plastic dual in-line compatible thermal enhanced very

thin quad ﬂat package; no leads; 20 terminals;

body 2.5

SOT764-1

4.5

0.85 mm

74HC_HCT244_3

Product data sheet

Rev. 03 — 22 December 2005

2 of 22

(C L ´

Philips Semiconductors

74HC244; 74HCT244

Octal buffer/line driver; 3-state

5. Functional diagram

1A0

1Y0

1A1

1Y1

1A2

1Y2

1A3

1Y3

1OE

2A0

2Y0

2A1

2Y1

2A2

2Y2

2A3

2Y3

2OE

mna875

Fig 1. Functional diagram

1A0

1Y0

2A0

2Y0

1A1

1Y1

2A1

2Y1

1A2

1Y2

2A2

2Y2

1A3

1Y3

2A3

2Y3

1OE

2OE

mna874

mna873

Fig 2. Logic symbol

Fig 3. IEC logic symbol

74HC_HCT244_3

Product data sheet

Rev. 03 — 22 December 2005

3 of 22

Philips Semiconductors

74HC244; 74HCT244

Octal buffer/line driver; 3-state

6. Pinning information

6.1 Pinning

74HC244

74HCT244

terminal 1

index area

74HC244

74HCT244

1A0

2OE

2Y0

1Y0

1OE

V CC

1A1

2A0

1A0

2OE

2Y0

1Y0

2Y1

1Y1

1A1

2A0

1A2

2A1

2Y1

1Y1

2Y2

1Y2

1A2

2A1

1A3

GND (1)

2A2

2Y2

1Y2

2Y3

1Y3

1A3

2A2

2Y3

1Y3

GND

2A3

001aae012

001aae011

Transparent top view

(1) The die substrate is attached to this

pad using conductive die attach

material. It can not be used as supply

pin or input

Fig 4. Pin conﬁguration DIP20, SO20,

SSOP20 and TSSOP20

Fig 5. Pin conﬁguration DHVQFN20

6.2 Pin description

Table 3: Pin description

Symbol

Description

1OE

1 output enable input (active LOW)

1A0

1 data input 0

2Y0

2 bus output 0

1A1

1 data input 1

2Y1

2 bus output 1

1A2

1 data input 2

2Y2

2 bus output 2

1A3

1 data input 3

2Y3

2 bus output 3

GND

ground (0 V)

2A3

2 data input 3

1Y3

1 bus output 3

2A2

2 data input 2

1Y2

1 bus output 2

74HC_HCT244_3

Product data sheet

Rev. 03 — 22 December 2005

4 of 22

Philips Semiconductors

74HC244; 74HCT244

Octal buffer/line driver; 3-state

Table 3: Pin description …continued

Symbol

Description

2A1

2 data input 1

1Y1

1 bus output 1

2A0

2 data input 0

1Y0

1 bus output 0

2OE

2 output enable input (active LOW)

V CC

supply voltage

7. Functional description

7.1 Function table

Table 4: Function table [1]

Control

Input

Output

nOE

nAn

nYn

[1] H = HIGH voltage level;

L = LOW voltage level;

X = don’t care;

Z = high-impedance OFF-state.

8. Limiting values

Table 5: Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to

GND (ground = 0 V).

Symbol Parameter

Conditions

Min Max Unit

V CC

supply voltage

0.5 +7

I IK

input clamping current

V I <

0.5 V or V I >V CC + 0.5 V

I OK

output clamping current

0.5 V or

V O >V CC + 0.5 V

I O

output current

V O =

0.5 V to (V CC + 0.5 V)

I CC

quiescent supply current

I GND

ground current

T stg

storage temperature

+150

P tot

total power dissipation

DIP20 package

[1] -

750 mW

SO20 package

[2] -

500 mW

SSOP20 package

[3] -

500 mW

TSSOP20 package

[3] -

500 mW

DHVQFN20 package

[4] -

500 mW

74HC_HCT244_3

Product data sheet

Rev. 03 — 22 December 2005

5 of 22

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