6N139.PDF

Low Input Current, High Gain

Optocouplers

Technical Data

6N139 6N138

HCPL-0701 HCPL-0700

HCNW139

HCNW138

Features

• High Current Transfer Ratio

– 2000% Typical (4500%

Typical for HCNW139/138)

• Low Input Current

Requirements – 0.5 mA

• TTL Compatible Output –

0.1 V V OL Typical

• Performance Guaranteed

over Temperature 0

Applications

• Ground Isolate Most Logic

Families – TTL/TTL, CMOS/

TTL, CMOS/CMOS, LSTTL/

TTL, CMOS/LSTTL

• Low Input Current Line

Receiver

• High Voltage Insulation

(HCNW139/138)

• EIA RS-232C Line Receiver

• Telephone Ring Detector

• 117 V ac Line Voltage Status

Indicator – Low Input Power

Dissipation

• Low Power Systems –

Ground Isolation

Description

These high gain series couplers

use a Light Emitting Diode and an

integrated high gain photodetec-

tor to provide extremely high

current transfer ratio between

input and output. Separate pins

for the photodiode and output

stage result in TTL compatible

saturation voltages and high

speed operation. Where desired

the V CC and V O terminals may be

tied together to achieve conven-

tional photodarlington operation.

A base access terminal allows a

gain bandwidth adjustment to be

made.

• Base Access Allows Gain

Bandwidth Adjustment

• High Output Current –

60 mA

• Safety Approval

UL Recognized – 2500 V rms

for 1 Minute and 5000 V rms*

for 1 Minute per UL 1577

CSA Approved

VDE 0884 Approved with

V IORM = 1414 V peak for

HCNW139 and HCNW138

BSI Certified (HCNW139 and

HCNW138)

• Available in 8-Pin DIP or

SOIC-8 Footprint or

Widebody Package

•MIL-STD-1772 Version

Available (HCPL-5700/1)

Functional Diagram

V CC

ANODE

V B

TRUTH TABLE

LED

OFF

CATHODE

V O

GND

*5000 V rms/1 minute rating is for HCNW139/138 and Option 020 (6N139/138) products only.

A 0.1 mF bypass capacitor connected between pins 8 and 5 is recommended.

CAUTION: It is advised that normal static precautions be taken in handling and assembly of this component to

prevent damage and/or degradation which may be induced by ESD.

5965-3599E

1-77

to 70

V O

LOW

HIGH

The 6N139, HCPL-0701, and

CNW139 are for use in CMOS,

LSTTL or other low power appli-

cations. A 400% minimum current

transfer ratio is guaranteed over

0 to 70

(1 TTL Unit load ). A 300%

minimum CTR enables operation

with 1 TTL Load using a 2.2 k

The SOIC-8 does not require

“through holes” in a PCB. This

package occupies approximately

one-third the footprint area of the

standard dual-in-line package.

The lead profile is designed to be

compatible with standard surface

mount processes.

pull-up resistor.

C operating range for only

0.5 mA of LED current.

Selection for lower input current

down to 250

A is available upon

request.

The 6N138, HCPL-0700, and

HCNW138 are designed for use

mainly in TTL applications.

Current Transfer Ratio (CTR) is

300% minimum over 0 to 70

The HCPL-0701 and HCPL-0700

are surface mount devices

packaged in an industry standard

SOIC-8 footprint.

The HCNW139 and HCNW138

are packaged in a widebody

encapsulation that provides creep-

age and clearance dimensions

suitable for safety approval by

regulatory agencies worldwide.

for an LED current of 1.6 mA

Selection Guide

Widebody

8-Pin DIP

Package

Hermetic

(300 Mil)

Small Outline SO-8 (400 mil)

Single and

Dual

Single

Dual

Minimum

Absolute

Dual

Single

Channel Channel Channel

Single

Input ON

Maxi-

Channel

Package Package Package Channel

Current

Minimum

mum

Packages

Package

HCPL-

Package

(I F )

CTR

V CC

HCPL-

6N139

2731 [1]

0701

0731

HCNW139

0.5 mA

400%

18 V

6N138

2730 [1]

0700

0730

HCNW138

1.6 mA

300%

7 V

HCPL-4701 [1]

4731 [1]

070A [1]

073A [1]

40 mA

800%

18 V

0.5 mA

300%

20 V

5701 [1]

5700 [1]

5731 [1]

5730 [1]

Note:

1. Technical data are on separate HP publications.

1-78

Ordering Information

Specify Part Number followed by Option Number (if desired).

Example:

6N139# XXX

020 = 5000 V rms/1 Minute UL Rating Option*

300 = Gull Wing Surface Mount Option†

500 = Tape and Reel Packaging Option

Option data sheets available. Contact your Hewlett-Packard sales representative or authorized distributor for

information.

*For 6N139 and 6N138 only.

†Gull wing surface mount option applies to through hole parts only.

Schematic

V CC

I CC

I F

ANODE

V F

–

CATHODE

I O

V O

GND

SHIELD

I B

V B

1-79

Package Outline Drawings

8-Pin DIP Package (6N139/6N138)**

9.65 ± 0.25

(0.380 ± 0.010)

7.62 ± 0.25

(0.300 ± 0.010)

TYPE NUMBER

OPTION CODE*

6.35 ± 0.25

(0.250 ± 0.010)

HP XXXXZ

DATE CODE

YYWW

RECOGNITION

1.19 (0.047) MAX.

1.78 (0.070) MAX.

5° TYP.

0.254 + 0.076

- 0.051

(0.010 + 0.003)

- 0.002)

4.70 (0.185) MAX.

0.51 (0.020) MIN.

2.92 (0.115) MIN.

1.080 ± 0.320

(0.043 ± 0.013)

0.65 (0.025) MAX.

2.54 ± 0.25

(0.100 ± 0.010)

DIMENSIONS IN MILLIMETERS AND (INCHES).

*MARKING CODE LETTER FOR OPTION NUMBERS

"L" = OPTION 020

OPTION NUMBERS 300 AND 500 NOT MARKED.

**JEDEC Registered Data.

8-Pin DIP Package with Gull Wing Surface Mount Option 300 (6N139/6N138)

PAD LOCATION (FOR REFERENCE ONLY)

9.65 ± 0.25

(0.380 ± 0.010)

1.016 (0.040 )

1.194 (0.047)

4.826

(0.190)

TYP.

6.350 ± 0.25

(0.250 ± 0.010)

9.398 (0.370)

9.906 (0.390)

1.194 (0.047 )

1.778 (0.070)

0.381 (0.015)

0.635 (0.025)

1.780

(0.070)

MAX.

9.65 ± 0.25

(0.380 ± 0.010)

1.19

(0.047)

MAX.

7.62 ± 0.25

(0.300 ± 0.010)

0.254 + 0.076

- 0.051

(0.010 + 0.003)

- 0.002)

4.19

(0.165) MAX.

1.080 ± 0.320

(0.043 ± 0.013)

0.635 ± 0.25

(0.025 ± 0.01 0)

12° NOM.

2.54

(0.100)

BSC

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

0.635 ± 0.130

(0.025 ± 0.005)

1-80

Small Outline SO-8 Package (HCPL-0701/HCPL-0700)

8765

5.842 ± 0.203

(0.236 ± 0.008)

XXX

YWW

3.937 ± 0.127

(0.155 ± 0.005)

TYPE NUMBER

(LAST 3 DIGITS)

DATE CODE

0.381 ± 0.076

(0.016 ± 0.003)

1.270

(0.050) BSG

5.080 ± 0.127

(0.200 ± 0.005)

7°

45° X

0.432

(0.017)

3.175 ± 0.127

(0.125 ± 0.005)

1.524

( 0 .060)

0.228 ± 0.025

(0.009 ± 0.001)

0.152 ± 0.051

(0.006 ± 0.002)

DIMENSIONS IN MILLIMETERS (INCHES).

LEAD COPLANARITY = 0.10 mm (0.004 INCHES).

0.305

(0.012) MIN.

8-Pin Widebody DIP Package (HCNW139/HCNW138)

11.15 ± 0.15

(0.442 ± 0.006)

11.00

(0.433)

9.00 ± 0.15

(0.354 ± 0.006)

MAX.

TYPE NUMBER

HCNWXXXX

DATE CODE

YYWW

10.16 (0.400)

TYP.

1.55

(0.061)

MAX.

7° TYP.

0.254 + 0.076

- 0.0051

(0.010 + 0.003)

- 0.002)

5.10

(0.201) MAX.

3.10 (0.122 )

3.90 (0.154)

0.51 (0.021) MIN.

2.54 (0.100)

TYP.

1.78 ± 0.15

(0.070 ± 0.006)

0.40 (0.016 )

0.56 (0.022)

DIMENSIONS IN MILLIMETERS (INCHES).

1-81

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