11_Power_WDT.pdf
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Redukcja mocy
Technika cyfrowa 2
Czynniki sprzyjajĢce redukcji mocy:
¤ technologia, maþy pobr prĢdu w trakcie standardowej pracy
¤ zmniejszenie czħstotliwoĻci sygnaþu taktujĢcego
wykĀad 11
¤ krtka faza miħdzy koıcem trybu redukcji mocy i standardowym
dziaþaniem
¤ podtrzymanie zawartoĻci wewnħtrznych pamiħci i rejestrw
¤ wyþĢcznie zbħdnych, nieuŇywanych ukþadw wewnħtrznych
¤ brak zewnħtrznych ukþadw, np. pamiħci programu, danych, peryferii
Katedra Metrologii Elektronicznej i Fotonicznej
Andrzej Stİpieĺ
¤ sprzħtowe / programowe tryby redukcji mocy
Wewnİtrzne generatory
(1/2)
Wewnİtrzne generatory
- Low/high-frequency oscillator:
¤ low-frequency 32,768-Hz watch crystals
¤standard crystals, resonators
¤external clock in the 450k .. 8MHz range
dzielnik
N=12, 6, 3, 1
powielacz
czħstotliwoĻci
M
f
OSC
N
M f
OSC
wewnħtrzny
generator
procesora
XTAL
f
CLK
=
2 * Cx
- Optional high-frequency oscillator:
¤standard crystals
¤resonators
¤external clock in the 450k .. 8MHz range
- Internal digitally controlled
oscillator (DCO) with RC-type characteristics.
C1*
R1*
Motorola
powielacz
czħstotliwoĻci
Phase
Locked
Loop
wewnħtrzny
generator
procesora
f
CLK
= 4 f
OSC
(Y+1) 2
2W+X
C2*
R2*
filtr dolnoprzepustowy
*)components must be based on crystal type;
contact crystal vendor for exact circuit
Internal RC Oscillator
ATmega8(L)
Oscillator Frequency vs.
Temperature
(the devices are calibrated to
8 MHz at V
CC
= 5V, T=25C)
AVR051: Set-up and Use the External RC Oscillator.
Application Note, Atmel Corporation 2002
Short start-up time of RC
oscillator:
max. 4 ´s + 10 clock cycles
1
3 R C
f
Frequency and Power Consumption for C=22pF
/
C=100pF
, simulated values
Resistor Value (kȪ) Frequency (MHz) Typical Consumption Current
1.2 11.9 /
4.54
1.0 /
0.57
2.2 7.36 /
2.32
1.0 /
0.18
3.9 4.40 /
1,41
0.57 /
0.18
8.2 1.98 0.18
18.0 0.99 0.18
C = 22 pF, and 12 pF stray capacitance (package, pad, pin, and PCB)
C = 100 pF, and 12 pF stray capacitance (package, pad, pin, and PCB), 5V
Oscillator Frequency vs.
Operating Voltage
(the devices are calibrated to
8 MHz at V
CC
= 5V, T=25C)
Ceramic Resonator Start-Up
Quartz Crystals Ceramic Resonators
C
X1,2
= 50 pF
TOM WILLIAMSON: Oscillators for Microcontrollers
APPLICATION NOTE AP-155, June 1983, Intel Corp.
Peter Mariutti: Ceramic Resonator Oscillators and the C500 and C166 Microcontroller Families.
ApNote AP242401, Infineon Technologies, 1999
ms
X2
sss
ss
Ceramic Resonator
Quartz Crystal
Price Factor (depends on quality)
1
2
Mechanical Shock Resistance
very good
good
C
X1,2
= 150 pF
Integrated Caps available
yes
no
Aging (for 10 years at room temperature) ° 3000 ppm
° 10 ppm
Initial Frequency Tolerance
° 2000 ... 5000 ppm
° 20 ppm
X2
Temperature Characteristics
° 20 ... 50 ppm/ C
° 0.5 ppm/ C
Load Capacitance Characteristics
° 100 ... 350 ppm/pF
° 15 ppm/pF
Oscillator Start-Up
(3.58 MHz Ceramic Resonator
from NTK Technical Ceramics)
Oscillation Rise Time
0.01 ... 0.5 msec
1 ... 10 msec
Quality Factor (Qm)
100 ... 5 000
10 000 ... 500 000
PCB - Ceramic Resonators
Rezonator kwarcowy
B. Gniewiıska, C. Klimek: Rezonatory i generatory kwarcowe. WKiý, Warszawa 1980
Peter Mariutti:
Crystal Oscillator
of the C500 and
C166
Microcontroller
Families.
ApNote AP242005,
Infineon
Technologies, 1999
Ukþad zastħpczy
rezonatora kwarcowego
bez obudowy i mocowania
Reaktancja
X
L
L
1
C
1
R
1
f
f
S
f
a
X
C
C
0
CzħstotliwoĻę rezonansu
szeregowego:
CzħstotliwoĻę rezonansu
rwnolegþego:
1
2 P ´ L
1
C
1
2 P
´
1
= f
S
´
C
1
1
1
L
1
C
0
f
S
=
f
a
=
+
1
+
L
1
C
1
C
0
Rezonator kwarcowy
Rezonator kwarcowy
Ukþad zastħpczy rezonatora kwarcowego z obudowĢ i mocowaniem
CzħstotliwoĻę rezonansu
rwnolegþego:
C
0ÓÓ
L
1
C
1
R
1
f
a
= f
S
´
C
1
C
L
+ C
0
R
HÓ
L
HÓ
L
HÓÓ
R
HÓÓ
1
+
A
B
C
X
gdzie:
C
AHÓ
C
AHÓÓ
C
0
C
BHÓÓ
C
BHÓ
C
X1
C
X2
C
X1
+ C
X2
C
X1
C
X2
C
L
= C
X
+
L
1
, R
1
, C
1
- indukcyjnoĻę, rezystancja i pojemnoĻę dynamiczna
C
0
- pojemnoĻę statyczna miħdzy elektrodami
L
HÓ
, R
HÓ
i L
HÓÓ
, R
HÓÓ
- indukcyjnoĻę i rezystancja obu doprowadzeı
C
AHÓÓ
, C
BHÓÓ
- pojemnoĻci statyczne miħdzy doprowadzeniami i obudowĢ
C
AHÓ
, C
BH
- pojemnoĻci statyczne miħdzy doprowadzeniami i obudowĢ
C
0ÓÓ
- pojemnoĻę doprowadzeı
H
L
1
C
1
R
1
f
a
- f
S
f
S
A
B
< 0,01 .. 0,5 %
C
0
Quartz Crystals
Quartz Crystals Ï supply current
Abdul Aleaf: A Study of the
Crystal Oscillator for
CMOS-COPS.
National Semiconductor.
Application Note 400,
August 1986
SG3030JC/JF 32kHz CRYSTAL OSCILLATOR. The Crystalmaster Product Catalog.
Epson November 2002
s
V
CC
f
CLK
t
CY
I
CC
I
CC
R
F
IC - equivalent to TC74HCU04 (unbuffer)
equivalent to TC74VHCU04 (unbuffer) 30..50 MHz
Toshiba Corp.
[V]
[Hz]
[ms]
[mA]
[mA]
2,4
32 k
125
8,5
4,4
5,0
32 k
125
83
10
IC
R
D
I
CC
- total power supply
current drain for COP410C
2,4
1 M
4
199
127
Symbol
5,0
1 M
4
360
283
Frequency range
R
F
(MW) R
D
(kW) C
G
(pF) C
D
(pF)
XÓtal
20 kHz to 60 kHz
20
500
10
60 kHz to 165 kHz
10
300
10
Crystal
Crystal
C
G
C
D
MSP430x43x, MSP430x44x.
Mixed Signal Microcontroller.
SLAS344C, January 2002-
Revised March 2003, Texas
Instrument
f
ACLK
= 32,768 kHz
ON
OFF
5.5 MHz to 30 MHz
1
0.5
5 to 15
LPM3
LPM4
(Fundamental)
30 MHz to 50 MHz
V
CC
= 2,2 V
I
CC
[mA] < 1,2 mA
< 0,5 mA
1
0.5
5 to 10
V
CC
= 3,0 V
I
CC
[mA] < 1,5 mA
< 0,5 mA
(Fundamental)
Startup Time
Crystal Oscillator Start-Up
C
X1,2
= 30 pF
Clay Turner: Use of theTMS320C5x Internal Oscillator With External Crystals or
Ceramic Resonators. SPRA054, October 1995, Texas Instruments
á
is dependent on the external components used, but
generally requires at last
s
after power-up for the oscillator to
stabilize. For this reason, a
s
of
s
is recommended
following power-up.Ñ
TOM WILLIAMSON: Oscillators for
Microcontrollers
APPLICATION NOTE AP-155, June 1983, Intel Corp.
V
CC
s
X2
COP8CBR9/COP8CCR9/COP8CDR9. 8-Bit CMOS Flash Microcontroller
with 32kMemory, Virtual EEPROM, 10-Bit A/D and Brownout.
DS101374, April 2002, National Semiconductor
10 MHz
C
X1,2
= 50 pF
V
CC
1 Î 10 ms
3.33 MHz
3 Î 10 ms
1 MHz
3 Î 20 ms
X2
455 kHz
10 Î 30 ms
Oscillator Start-Up (4.608 MHz Crystal
from Standard Crystal Corp.)
sss
Parametry rezonatorw kwarcowych
Nominal frequency range
Crystal Specifications
Crystal Considerations with
Dallas Real Time Clocks. APP58,
Dallas Semiconductor, 1995
Parameter
Symbol
Min
Typ
Max
Units
f
32.768 kHz
Temperature
storage
T
STG
-55C to +125C
Nominal Frequency
F
0
32,768
kHz
range
operating
T
OPR
-40C to +85C
C
L
Load Capacitance
6
pF
Maximum drive level
GL
1,0 mW
MAX
T
0
k
o
Temperature Turnover Point
Parabolic Curvature Constant
Quality Factor
Series Resistance
Shunt Capacitance
Capacitance Ratio
Drive Level
20
25
30
C
ppm/ C
Soldering condition
T
SOL
Twice at under 260C within 10 sec.
or under 230C within 3 min.
o
0,042
Q
40.000
70.000
Frequency tolerance (standard)
Df/f
20ppm or 50ppm
(Ta=25C, DL=0.1mW)
Daiwa DS-26S Crystal
Specifications
R1
C
0
45
kW
pF
1,1
1,8
Peak temperature (frequency)
qT
25C 5C
C / C
0
Temperature coefficient (frequency) a
-0.04ppm/C
MAX
430
600
1
1
D
L
mW
Series resistance
R
1
50kW
MAX
0
-20
-40
-80
Motional capacitance
C
1
1.8pF
MAX
(25C):
30 seconds / month (C
L
= 6 pF)
4 minutes / month (C
L
= 12 pF)
Delta
frequency
[ppm]
Shunt capacitance
C
0
0.9pF
MAX
-60
-100
-120
-160
Insulation resistance
IR
500MW
MIN
Aging
fa
3ppm/Y
MAX
(Ta=25C 3C, first year)
-140
-180
Shock resistance
S.R.
5ppm
MAX
(test with:
3000G x 1/2 sine wave x 3 directions)
-40 -30 -20 -10
0
10
20
30
40
50
60
70
80
Temperature [C]
PCB - Crystal Oscillator
Peter Mariutti: Crystal Oscillator of the C500 and C166 Microcontroller Families.
ApNote AP242005, Infineon Technologies, 1999
MSP430 Low Power Mode
sss
RST/NMI
Reset Active
Vcc On
WDT Active
Time Expired, Overflow
WDTIFG=1
POR
WDTIFG=0
RST/NMI is Reset Pin
WDT is Active
PUC
WDT Active
Security Key Violation
RST/NMI
NMI Active
CPU is Active
Various Modules are Active
CPU Off, MCLK Off,
SMCLK On
DCO On, DC Gen On
ACLK On
CPU Off, MCLK Off, SMCLK Off
DCO Off, DC Gen Off
ACLK Off
Icc=225mA (@Vcc=2,2V)
CPU Off, MCLK Off,
SMCLK On
DCO Off,
DC Gen On
ACLK On
CPU Off, MCLK Off, SMCLK Off
DCO Off, DC Gen Off
ACLK On
Icc=0,1mA
@Vcc=2,2V
CPU Off, MCLK Off, SMCLK Off
DCO Off,
DC Gen On
ACLK On
Icc=65mA
@Vcc=2,2V
Icc=1mA
@Vcc=2,2V
Icc=11mA (@Vcc=2,2V)
COP8CBR
COP8CBR
HS Osc on
LS Osc off
T0 clked by HS Osc
Icc max
Operating Voltage
2,7 .. 5,5 V
HS Osc off
Normal Mode
High Speed Mode 13,2 mA
Dual Clock Mode 13,2 mA
Low Speed Mode 103 ´A
Idle Mode
High Speed Mode 2,5 mA
Dual Clock Mode 2,5 mA
Low Speed Mode 30 ´A
Supply Current for BOR Feature
45 ´A
HALT Current with BOR Disabled
High Speed Mode 10 ´A
Dual Clock Mode 17 ´A
Low Speed Mode 17 ´A
Power Supply Rise Time
< 50 x 10
6
ns
Reset
Power Supply Ripple
Peak-to-Peak
< 0.1 Vcc
LS Osc on
CKI = 10 MHz, Vcc = 5,5 V
Low Speed OSC = 32 kHz
32 kHz
HS Osc off
LS Osc on
HS Osc off
LS Osc on
HS Osc on
LS Osc on
T0 clked by LS Osc
10 MHz
HS Osc off
LS Osc on
HS Osc off
LS Osc on
1 Î 10 ms
3.33 MHz
3 Î 10 ms
HS Osc off
LS Osc on
T0 clked by LS Osc
1 MHz
3 Î 20 ms
455 kHz
10 Î 30 ms
s
ss
The low speed oscillator is left on in HALT mode, because
ss
s
.
Power Management Mode (PMM)
Technology
External Interrupt or RESET
Icc [mA]
clocks per machine cycle:
PMM1
XTAL/64
Idle Mode
(only CPU OFF)
25
80C32
(12 clocks)
80C31
(12 clocks)
80C32
(12 clocks)
ss
s
20
software
hardware
80C31
(12 clocks)
15
Stop Mode
XTAL OFF
(All OFF)
10
PMM2
XTAL/1024
DS80C320
(4 clocks)
performance 2,5x
DS80C320
(4 clocks)
performance 2,5x
5
1 2
4
6
8
10
12
14
16
18
20
s
Performance relative to 1 MHz 8051
Kevin Self - Microcontrollers Applications
Engineer, Dallas Semiconductor Corporation
Power Management Mode (PMM)
Exit from Stop Mode
4 .. 10 ms
mC operating
mC operating
Icc [mA]
Cristal
Oscillator
Power
Type of mode:
35
XTAL/4
(active mode
full speed)
30
mC enters
Stop Mode
Ext. Interrupt
Clock starts
Clock
stabile
mC enters
Stop Mode
25
20
mC operating
Cristal
Oscillator
15
mC operating
(backward software
compatibility)
Idle
XTAL/64
(PMM1 with NOP)
XTAL/1024
(PMM2 with NOP)
Stop Mode
(1 mA)
10
RC
Oscillator
5
Power
Power saved
1 2
4
6
8 10 12 14 16 18 20
22 24 26 28 30
Ext. Interrupt
Clock starts
mC enters
Stop Mode
mC enters
Stop Mode
Frequency [MHz]
Power Management Mode (PMM)
External Memory
Icc [mA]
Type of memory:
80
External
DS87C520,
74AC573,
27C256 (70ns)
Internal or External
Program Memor
60
40
Burst Mode Operation
Energy consumed vs. processor speed for a 500 machine cycle task, active mode
Internal
DS87C520
(16KB of EPROM)
20
10
1 2 4 6 8
10
12 14 16 18 20
22 24 26
28
30
Frequency [MHz]
Clock
Machine
Total
Current
Icc [mA]
Frequency
Cycle
Time
I
CC
-Time
Type of memory:
50
Period
Product
External
DS87C520,
74AC573,
DS2064
(8Kx8 Static RAM)
40
10 MHz
400 ns
200 ms
12,41 mA
248 mAs
Internal or External
Data Memory
30
Internal
230 mAs (
)
30 MHz
133 ns
66,5 ms
34,66 mA
DS87C520
(1 KB internal MOVX data memory)
20
10
5
1 2 4 6 8 10 12 14 16 18 20
22 24 26 28 30
Frequency [MHz]
DVS
Problemy z zasilaniem
niewþaĻciwe zasilanie:
¤ niedostateczna filtracja napiħę zasilajĢcych
¤ przepiħcia w ukþadach zasilania
¤ duŇe spadki napiħę na doprowadzeniach, ĻcieŇkach drukowanych pþytki
¤ zaniki zasilania
zmniejszenie wraŇliwoĻci na zakþcenia przedostajĢce siħ przez zasilanie:
¤ wþaĻciwa filtracja napiħę zasilajĢcych, dodatkowe kondensatory filtrujĢce,
dþawiki ferromagnetyczne
¤ stosowanie ukþadw zabezpieczajĢcych przed przepiħciami
¤ skrcenie dþugoĻci poþĢczeı miħdzy mikroprocesorem, a zewnħtrznymi
ukþadami i zasilaczem
¤ wþaĻciwe prowadzenie ĻcieŇek na pþytce drukowanej
¤ zewnħtrzne / wewnħtrzne kontrolery napiħę zasilajĢcych
ynamic
oltage
caling:
¤ dynamiczne przeþĢczanie napiħę zasilajĢcych w ukþadach, ktre nie
pracujĢ z peþnĢ mocĢ (np. odtwarzacz MP3, internetowe audio, kamera
cyfrowa itp.)
¤ obniŇenie napiħcia zasilania rdzenia (U
CC
), zmniejszenie czħstotliwoĻci
taktujĢcej (f
CLK
) w mikroprocesorach, procesorach sygnaþowych (DSP)
¤ pobr energii proporcjonalny do (U
CC
)
2
* f
CLK
, zmiana czħstotliwoĻci
taktujĢcej
¤ wydþuŇenie czasu Ňycia baterii o ok. 15-25% przy oszczħdnym
gospodarowaniu energiĢ
¤ wþaĻciwe zaprojektowanie struktury mikroprocesora, DSP sterujĢcej
stabilizatorem napiħcia
Plik z chomika:
pir23
Inne pliki z tego folderu:
01.pdf
(2217 KB)
02.pdf
(948 KB)
03.pdf
(2327 KB)
04.pdf
(794 KB)
05.pdf
(692 KB)
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